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نمایش تعداد 1-7 از 7

Localized Synthesis of Carbon Nanotube Films on Suspended Microstructures by Laser-Assisted Chemical Vapor Deposition

نوع: Journal Paper

نویسنده : Yuanchao Li; Wenzhou Ruan; Zheyao Wang

سال: 2013

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Thermal and electrical tests of air-gap TSV

نوع: Conference Paper

نویسنده : Cui Huang , Dong Wu , Zheyao Wang

ناشر: IEEE

سال: 2014

Data Compression for Image Sensor Arrays Using a 15-bit Two-Step Sigma–Delta ADC

نوع: Journal Paper

نویسنده : Mengyun Yue; Dong Wu; Zheyao Wang

ناشر: IEEE

سال: 2014

The influence of ultrasonic agitation on copper electroplating of blind-vias for SOI three-dimensional integration

نوع: Journal Paper

نویسنده : Qianwen Chen; Zheyao Wang; Jian Cai; Litian Liu

ناشر: Elsevier Science

سال: 2010

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Reactive ion etching characteristics of partially-cured benzocyclobutene

نوع: Conference Paper

نویسنده : Yang Yang; Zhen Song; Yuxin Du; Zheyao Wang

ناشر: IEEE

سال: 2014

Reliability of Au-Si eutectic bonding

نوع: Conference Paper

نویسنده : Tianxiang Ye; Zhen Song; Yuxin Du; Zheyao Wang

ناشر: IEEE

سال: 2014

Thermal and Electrical Properties of BCB-Liner Through-Silicon Vias

نوع: Journal Paper

نویسنده : Cui Huang; Liyang Pan; Ran Liu; Zheyao Wang

ناشر: IEEE

سال: 2014

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Localized Synthesis of Carbon Nanotube Films on Suspended Microstructures by Laser-Assisted Chemical Vapor Deposition

Thermal and electrical tests of air-gap TSV

Data Compression for Image Sensor Arrays Using a 15-bit Two-Step Sigma–Delta ADC

The influence of ultrasonic agitation on copper electroplating of blind-vias for SOI three-dimensional integration

Reactive ion etching characteristics of partially-cured benzocyclobutene

Reliability of Au-Si eutectic bonding

Thermal and Electrical Properties of BCB-Liner Through-Silicon Vias

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Localized Synthesis of Carbon Nanotube Films on Suspended Microstructures by Laser-Assisted Chemical Vapor Deposition

Thermal and electrical tests of air-gap TSV

Data Compression for Image Sensor Arrays Using a 15-bit Two-Step Sigma&#x2013;Delta ADC

The influence of ultrasonic agitation on copper electroplating of blind-vias for SOI three-dimensional integration

Reactive ion etching characteristics of partially-cured benzocyclobutene

Reliability of Au-Si eutectic bonding

Thermal and Electrical Properties of BCB-Liner Through-Silicon Vias

Data Compression for Image Sensor Arrays Using a 15-bit Two-Step Sigma–Delta ADC