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نمایش تعداد 1-10 از 30

Fast and Broadband Modeling Method for Multiple Vias With Irregular Antipad in Arbitrarily Shaped Power/Ground Planes in 3-D IC and Packaging Based on Generalized Foldy–Lax Equations

نوع: Journal Paper

نویسنده : Xin Chang; Leung Tsang

ناشر: IEEE

سال: 2014

Analysis of modes effect on signal/power integrity in finite cavity for chip and die level packaging based on a hybrid full wave method

نوع: Conference Paper

نویسنده : Xin Chang , Leung Tsang

ناشر: IEEE

سال: 2014

Managerial Entrenchment and Firm Value: A Dynamic Perspective

نوع: Journal Paper

نویسنده : Xin Chang; Hong Feng Zhang

سال: 2015

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The Effect of Auditor Quality on Financing Decisions

نوع: Journal Paper

نویسنده : Xin Chang; Sudipto Dasgupta; Gilles Hilary

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Performance improvement of CM/DM noise separator with impedance matching approach

نوع: Conference Paper

نویسنده : Xinli Chang , Wenjie Chen , Xu Yang

ناشر: IEEE

سال: 2014

Efficient electromagnetic modeling and analysis for off-chip interconnects in SIW structures and 3D ICs

نوع: Conference Paper

نویسنده : Xin Chang , Leung Tsang , Sudhakaran, S.

ناشر: IEEE

سال: 2014

Stock Liquidity and Stock Price Crash Risk

نوع: Journal Paper

نویسنده : Xin Chang; Yangyang Chen; Leon Zolotoy

سال: 2017

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Industry Expertise, Information Leakage and the Choice of M&A Advisors

نوع: Journal Paper

نویسنده : Xin Chang; Chander Shekhar; Lewis H. K. Tam; Jiaquan Yao

سال: 2016

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Audit quality, auditor compensation and initial public offering underpricing

نوع: Journal Paper

نویسنده : Xin Chang; André F. Gygax; Elaine Oon; Hong Feng Zhang

سال: 2008

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Network modeling and evolutionary optimization for scheduling in manufacturing

نوع: Journal Paper

نویسنده : Lin Lin, Xin-Chang Hao, Mitsuo Gen, Jung-Bok Jo

سال: 2012

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Fast and Broadband Modeling Method for Multiple Vias With Irregular Antipad in Arbitrarily Shaped Power/Ground Planes in 3-D IC and Packaging Based on Generalized Foldy–Lax Equations

Analysis of modes effect on signal/power integrity in finite cavity for chip and die level packaging based on a hybrid full wave method

Managerial Entrenchment and Firm Value: A Dynamic Perspective

The Effect of Auditor Quality on Financing Decisions

Performance improvement of CM/DM noise separator with impedance matching approach

Efficient electromagnetic modeling and analysis for off-chip interconnects in SIW structures and 3D ICs

Stock Liquidity and Stock Price Crash Risk

Industry Expertise, Information Leakage and the Choice of M&A Advisors

Audit quality, auditor compensation and initial public offering underpricing

Network modeling and evolutionary optimization for scheduling in manufacturing

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Fast and Broadband Modeling Method for Multiple Vias With Irregular Antipad in Arbitrarily Shaped Power/Ground Planes in 3-D IC and Packaging Based on Generalized Foldy&#x2013;Lax Equations

Analysis of modes effect on signal/power integrity in finite cavity for chip and die level packaging based on a hybrid full wave method

Managerial Entrenchment and Firm Value: A Dynamic Perspective

The Effect of Auditor Quality on Financing Decisions

Performance improvement of CM/DM noise separator with impedance matching approach

Efficient electromagnetic modeling and analysis for off-chip interconnects in SIW structures and 3D ICs

Stock Liquidity and Stock Price Crash Risk

Industry Expertise, Information Leakage and the Choice of M&A Advisors

Audit quality, auditor compensation and initial public offering underpricing

Network modeling and evolutionary optimization for scheduling in manufacturing

Fast and Broadband Modeling Method for Multiple Vias With Irregular Antipad in Arbitrarily Shaped Power/Ground Planes in 3-D IC and Packaging Based on Generalized Foldy–Lax Equations