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نمایش تعداد 1-10 از 21

Electromigration induced failure of solder bumps and the role of IMC

نوع: Conference Paper

نویسنده : Ceric, H. , Selberherr, S.

ناشر: IEEE

سال: 2014

Spray pyrolysis deposition for gas sensor integration in the backend of standard CMOS processes

نوع: Conference Paper

نویسنده : Filipovic, L.; Selberherr, S.

ناشر: IEEE

سال: 2014

Electromigration reliability of solder bumps

نوع: Conference Paper

نویسنده : Ceric, H. , Selberherr, S.

ناشر: IEEE

سال: 2014

A CMOS IC for portable EEG acquisition systems

نوع: Journal Paper

نویسنده : Martins, R.; Selberherr, S.; Vaz, F.A.

سال: 1998

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Spin diffusion and the role of screening effects in semiconductors

نوع: Conference Paper

نویسنده : Ghosh, J. , Sverdlov, V. , Selberherr, S.

ناشر: IEEE

سال: 2014

Efficient calculation of the two-dimensional Wigner potential

نوع: Conference Paper

نویسنده : Ellinghaus, P. , Nedjalkov, M. , Selberherr, S.

ناشر: IEEE

سال: 2014

Spin lifetime in strained silicon films

نوع: Conference Paper

نویسنده : Sverdlov, V. , Osintsev, D. , Selberherr, S.

ناشر: IEEE

سال: 2014

The Wigner Monte Carlo method for accurate semiconductor device simulation

نوع: Conference Paper

نویسنده : Ellinghaus, P.; Nedjalkov, M.; Selberherr, S.

ناشر: IEEE

سال: 2014

Implications of the coherence length on the discrete Wigner potential

نوع: Conference Paper

نویسنده : Ellinghaus, P. , Nedjalkov, M. , Selberherr, S.

ناشر: IEEE

سال: 2014

Process and reliability of SF<inf>6</inf>/O<inf>2</inf> plasma etched copper TSVs

نوع: Conference Paper

نویسنده : Filipovic, L. , de Orio, R.L. , Selberherr, S.

ناشر: IEEE

سال: 2014

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Electromigration induced failure of solder bumps and the role of IMC

Spray pyrolysis deposition for gas sensor integration in the backend of standard CMOS processes

Electromigration reliability of solder bumps

A CMOS IC for portable EEG acquisition systems

Spin diffusion and the role of screening effects in semiconductors

Efficient calculation of the two-dimensional Wigner potential

Spin lifetime in strained silicon films

The Wigner Monte Carlo method for accurate semiconductor device simulation

Implications of the coherence length on the discrete Wigner potential

Process and reliability of SF<inf>6</inf>/O<inf>2</inf> plasma etched copper TSVs

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Electromigration induced failure of solder bumps and the role of IMC

Spray pyrolysis deposition for gas sensor integration in the backend of standard CMOS processes

Electromigration reliability of solder bumps

A CMOS IC for portable EEG acquisition systems

Spin diffusion and the role of screening effects in semiconductors

Efficient calculation of the two-dimensional Wigner potential

Spin lifetime in strained silicon films

The Wigner Monte Carlo method for accurate semiconductor device simulation

Implications of the coherence length on the discrete Wigner potential

Process and reliability of SF<inf>6</inf>/O<inf>2</inf> plasma etched copper TSVs