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Mr. Synopsys Speaks: The <italic>Aart</italic> of Tech-Onomic Orchestration of Adjacent Version <inline-formula> <img src="/images/tex/21222.gif" alt="n+1"> </inline-formula>

نوع: Journal Paper

نویسنده : Marinissen, Erik Jan

ناشر: IEEE

سال: 2014

Low-Cost Post-Bond Testing of 3-D ICs Containing a Passive Silicon Interposer Base

نوع: Journal Paper

نویسنده : Chun-Chuan Chi; Marinissen, Erik Jan; Goel, Sandeep Kumar; Cheng-Wen Wu

ناشر: IEEE

سال: 2014

Direct probing on large-array fine-pitch micro-bumps of a wide-I/O logic-memory interface

نوع: Conference Paper

نویسنده : Marinissen, Erik Jan; De Wachter, Bart; Smith, Ken; Kiesewetter, Jorg; Taouil, Mottaqiallah; Hamdioui, Said

ناشر: IEEE

سال: 2014

Cost components for 3D system integration

نوع: Conference Paper

نویسنده : Velenis, Dimitrios; Detalle, Mikael; Van Huylenbroeck, Stefaan; Jourdain, Anne; Phommahaxay, Alain; Slabbekoorn, John; Wang, Teng; Marinissen, Erik Jan; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric

ناشر: IEEE

سال: 2014

Reflow process optimization for micro-bumps applications in 3D technology

نوع: Conference Paper

نویسنده : Derakhshandeh, Jaber; De Preter, Inge; England, Luke; Schmid, Daniel; Slabbekoorn, John; Vakanas, George; Wang, Teng; Beyer, Gerald; Beyne, Eric; Marinissen, Erik Jan; Rebibis, Kenneth June; Lerch, Wilfried; Miller, Andy

ناشر: IEEE

سال: 2014

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Mr. Synopsys Speaks: The <italic>Aart</italic> of Tech-Onomic Orchestration of Adjacent Version <inline-formula> <img src="/images/tex/21222.gif" alt="n+1"> </inline-formula>

Low-Cost Post-Bond Testing of 3-D ICs Containing a Passive Silicon Interposer Base

Direct probing on large-array fine-pitch micro-bumps of a wide-I/O logic-memory interface

Cost components for 3D system integration

Reflow process optimization for micro-bumps applications in 3D technology

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Mr. Synopsys Speaks: The <italic>Aart</italic> of Tech-Onomic Orchestration of Adjacent Version <inline-formula> <img src="/images/tex/21222.gif" alt="n+1"> </inline-formula>

Low-Cost Post-Bond Testing of 3-D ICs Containing a Passive Silicon Interposer Base

Direct probing on large-array fine-pitch micro-bumps of a wide-I/O logic-memory interface

Cost components for 3D system integration

Reflow process optimization for micro-bumps applications in 3D technology