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نمایش تعداد 1-10 از 12

Novel 4<italic>F</italic><sup>2</sup> Buried-Source-Line STT MRAM Cell With Vertical GAA Transistor as Select Device

نوع: Journal Paper

نویسنده : Verma, Shalini; Kaundal, Shalu; Kaushik, B.K.

ناشر: IEEE

سال: 2014

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نوع: Journal Paper

نویسنده : Verma, Shalini; Kaundal, Shalu; Kaushik, B.K.

ناشر: IEEE

سال: 2014

Low-power and robust 6T SRAM cell using symmetric dual-k spacer FinFETs

نوع: Conference Paper

نویسنده : Pal, P.K. , Kaushik, B.K. , Dasgupta, S.

ناشر: IEEE

سال: 2014

Modeling of crosstalk effects in coupled MLGNR interconnects based on FDTD method

نوع: Conference Paper

نویسنده : Kumar, V.R. , Kaushik, B.K. , Patnaik, A.

ناشر: IEEE

سال: 2014

Design Metrics Improvement for SRAMs Using Symmetric Dual-<formula formulatype="inline"> <img src="/images/tex/348.gif" alt="k"> </formula> Spacer (SymD-<formula formulatype="inline"> <img src="/images/tex/348.gif" alt="k"> </formula>) FinFETs

نوع: Journal Paper

نویسنده : Pal, Pankaj Kumar; Kaushik, B.K.; Dasgupta, S.

ناشر: IEEE

سال: 2014

Analysis of electrical parameters of organic thin film transistors based on thickness variation in semiconducting and dielectric layers

نوع: Journal Paper

نویسنده : Kumar, Bijendra; Kaushik, B.K.; Negi, Yuvraj Singh

ناشر: IET

سال: 2014

Graphene Based On-Chip Interconnects and TSVs : Prospects and Challenges

نوع: Journal Paper

نویسنده : Kumar, Vobulapuram Ramesh; Kaushik, B.K.; Majumder, Manoj Kumar

ناشر: IEEE

سال: 2014

Frequency response and bandwidth analysis of multi-layer graphene nanoribbon and multi-walled carbon nanotube interconnects

نوع: Journal Paper

نویسنده : Majumder, Manoj Kumar; Kukkam, Narasimha Reddy; Kaushik, B.K.

ناشر: IET

سال: 2014

An Accurate FDTD Model for Crosstalk Analysis of CMOS-Gate-Driven Coupled RLC Interconnects

نوع: Journal Paper

نویسنده : Kumar, Vobulapuram Ramesh; Kaushik, B.K.; Patnaik, Amalendu

ناشر: IEEE

سال: 2014

Analysis of Delay and Dynamic Crosstalk in Bundled Carbon Nanotube Interconnects

نوع: Journal Paper

نویسنده : Majumder, Manoj Kumar; Kaushik, B.K.; Manhas, Sanjeev Kumar

ناشر: IEEE

سال: 2014

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Novel 4<italic>F</italic><sup>2</sup> Buried-Source-Line STT MRAM Cell With Vertical GAA Transistor as Select Device

Untitled

Low-power and robust 6T SRAM cell using symmetric dual-k spacer FinFETs

Modeling of crosstalk effects in coupled MLGNR interconnects based on FDTD method

Design Metrics Improvement for SRAMs Using Symmetric Dual-<formula formulatype="inline"> <img src="/images/tex/348.gif" alt="k"> </formula> Spacer (SymD-<formula formulatype="inline"> <img src="/images/tex/348.gif" alt="k"> </formula>) FinFETs

Analysis of electrical parameters of organic thin film transistors based on thickness variation in semiconducting and dielectric layers

Graphene Based On-Chip Interconnects and TSVs : Prospects and Challenges

Frequency response and bandwidth analysis of multi-layer graphene nanoribbon and multi-walled carbon nanotube interconnects

An Accurate FDTD Model for Crosstalk Analysis of CMOS-Gate-Driven Coupled RLC Interconnects

Analysis of Delay and Dynamic Crosstalk in Bundled Carbon Nanotube Interconnects

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Novel 4<italic>F</italic><sup>2</sup> Buried-Source-Line STT MRAM Cell With Vertical GAA Transistor as Select Device

Untitled

Low-power and robust 6T SRAM cell using symmetric dual-k spacer FinFETs

Modeling of crosstalk effects in coupled MLGNR interconnects based on FDTD method

Design Metrics Improvement for SRAMs Using Symmetric Dual-<formula formulatype="inline"> <img src="/images/tex/348.gif" alt="k"> </formula> Spacer (SymD-<formula formulatype="inline"> <img src="/images/tex/348.gif" alt="k"> </formula>) FinFETs

Analysis of electrical parameters of organic thin film transistors based on thickness variation in semiconducting and dielectric layers

Graphene Based On-Chip Interconnects and TSVs : Prospects and Challenges

Frequency response and bandwidth analysis of multi-layer graphene nanoribbon and multi-walled carbon nanotube interconnects

An Accurate FDTD Model for Crosstalk Analysis of CMOS-Gate-Driven Coupled RLC Interconnects

Analysis of Delay and Dynamic Crosstalk in Bundled Carbon Nanotube Interconnects