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نمایش تعداد 1-7 از 7

A differential evolution algorithm based source reconstruction technique

نوع: Conference Paper

نویسنده : Wei-Jiang Zhao; Binfang Wang; En-Xiao Liu

ناشر: IEEE

سال: 2014

Fast Contour Integral Equation Method for Wideband Power Integrity Analysis

نوع: Journal Paper

نویسنده : Huapeng Zhao; En-Xiao Liu; Jun Hu; Er-Ping Li

ناشر: IEEE

سال: 2014

Efficient analysis for multilayer power-ground planes with multiple vias and signal traces in an advanced electronic package

نوع: Journal Paper

نویسنده : Zaw Oo Zaw; Xing Chang Wei; En-Xiao Liu; Er-Ping Li; Le-Wei Li

سال: 2008

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Recent advances in electromagnetic compatibility of 3D-ICs &2013; Part I

نوع: Journal Paper

نویسنده : Etienne Sicard; Wu Jianfei; R. J. Shen; Er-Ping Li; En-Xiao Liu; J. Kim; Jonghyun Cho; Madhavan Swaminathan

سال: 2015

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Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards With Vias and Decoupling Capacitors

نوع: Journal Paper

نویسنده : Yao-Jiang Zhang; Zaw Zaw Oo; Xing-Chang Wei; En-Xiao Liu; Jun Fan; Er-Ping Li

سال: 2010

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Recent advances in electromagnetic compatibility of 3D-ICs — Part II

نوع: Journal Paper

نویسنده : Etienne Sicard; Wu Jianfei; Rongjun Shen; Er-Ping Li; En-Xiao Liu; Joungho Kim; Jonghyun Cho; Madhavan Swaminathan

سال: 2016

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3D traffic noise mapping using unstructured surface mesh representation of buildings and roads

نوع: Journal Paper

نویسنده : Wei-Jiang Zhao; En-Xiao Liu; Hee Joo Poh; Binfang Wang; Si-Ping Gao; Ching Eng Png; Kelvin Wenhui Li; Shyh Hao Chong

سال: 2017

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A differential evolution algorithm based source reconstruction technique

Fast Contour Integral Equation Method for Wideband Power Integrity Analysis

Efficient analysis for multilayer power-ground planes with multiple vias and signal traces in an advanced electronic package

Recent advances in electromagnetic compatibility of 3D-ICs &2013; Part I

Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards With Vias and Decoupling Capacitors

Recent advances in electromagnetic compatibility of 3D-ICs — Part II

3D traffic noise mapping using unstructured surface mesh representation of buildings and roads

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A differential evolution algorithm based source reconstruction technique

Fast Contour Integral Equation Method for Wideband Power Integrity Analysis

Efficient analysis for multilayer power-ground planes with multiple vias and signal traces in an advanced electronic package

Recent advances in electromagnetic compatibility of 3D-ICs &2013; Part I

Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards With Vias and Decoupling Capacitors

Recent advances in electromagnetic compatibility of 3D-ICs — Part II

3D traffic noise mapping using unstructured surface mesh representation of buildings and roads