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Drawbacks of the nanoparticle reinforced lead-free BGA solder joints

Type: Conference Paper

Author : Sun, Huayu; Chan, Y.C.

Publisher: IEEE

Year: 2014

Electroless Ni-P-ZrO<inf>2</inf> metallization for lead-free solder interconnection

Type: Conference Paper

Author : Xiao Hu; Chan, Y.C.

Publisher: IEEE

Year: 2014

Effect of pad shape on electromigration in solder bump joints

Type: Conference Paper

Author : Li, Yi; Chan, Y.C.; Zhao, Xiuchen

Publisher: IEEE

Year: 2014

Evaluation of Schottky contact parameters in metalâ semiconductorâ metal photodiode structures

Type: Journal Paper

Author : Averine, S.; Chan, Y. C.; Lam, Y. L.

Publisher: American Institute of Physics

Year: 2000

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On-chip multilayer inductor design in near-field wireless connection for 3D-system integration

Type: Conference Paper

Author : Zhang, Xiaodong; Zou, Xuecheng; Chan, Y C; Tong, Qiaoling

Publisher: IEEE

Year: 2014

Interfacial microstructure and shear strength of Sn-Ag-Cu based composite solders on Cu and Au/Ni metallized Cu substrates

Type: Conference Paper

Author : Fouzder, Tama; Chan, Y.C.; Chan, Daniel K.

Publisher: IEEE

Year: 2014

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Drawbacks of the nanoparticle reinforced lead-free BGA solder joints

Electroless Ni-P-ZrO<inf>2</inf> metallization for lead-free solder interconnection

Effect of pad shape on electromigration in solder bump joints

Evaluation of Schottky contact parameters in metalâ semiconductorâ metal photodiode structures

On-chip multilayer inductor design in near-field wireless connection for 3D-system integration

Interfacial microstructure and shear strength of Sn-Ag-Cu based composite solders on Cu and Au/Ni metallized Cu substrates

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Drawbacks of the nanoparticle reinforced lead-free BGA solder joints

Electroless Ni-P-ZrO<inf>2</inf> metallization for lead-free solder interconnection

Effect of pad shape on electromigration in solder bump joints

Evaluation of Schottky contact parameters in metalâ semiconductorâ metal photodiode structures

On-chip multilayer inductor design in near-field wireless connection for 3D-system integration

Interfacial microstructure and shear strength of Sn-Ag-Cu based composite solders on Cu and Au/Ni metallized Cu substrates