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Now showing items 1-10 of 19

Investigation on AlCu-clad base plates and a new by-pass cooler for pin fin power modules

Type: Conference Paper

Author : Uhlemann, Andre , Fath, Thorsten , Hymon, Erwin

Publisher: IEEE

Year: 2014

Growth of low defect-density InP on exact Si (001) substrates by metalorganic chemical vapor deposition with position-controlled seed arrays

Type: Conference Paper

Publisher: IEEE

Year: 2014

Laminate with Thermal - Power Insert for Efficient Front-Side Heat Removal and Power Delivery

Type: Conference Paper

Publisher: IEEE

Year: 2014

Surface Profiles of Printed Ag Nanoparticle Paste and Their Implication on the Quality of Sintered Joints

Type: Conference Paper

Publisher: IEEE

Year: 2014

Reliability assessment of molded Smart Power Modules

Type: Conference Paper

Publisher: IEEE

Year: 2014

3D stereoscopic game development technique for smart TVs

Type: Conference Paper

Publisher: IEEE

Year: 2014

Haptic strip based on modular independent actuators for virtual shapes rendering

Type: Conference Paper

Publisher: IEEE

Year: 2014

100K Q-factor toroidal ring gyroscope implemented in wafer-level epitaxial silicon encapsulation process

Type: Conference Paper

Publisher: IEEE

Year: 2014

AlGaN/GaN MIS-HFET with improvement in high temperature gate bias stress-induced reliability

Type: Conference Paper

Publisher: IEEE

Year: 2014

Misleading Generalized Itemset Mining in the Cloud

Type: Conference Paper

Author : Baralis, E.; Cagliero, L.; Cerquitelli, T.; Chiusano, S.; Garza, P.; Grimaudo, L.; Pulvirenti, F.

Publisher: IEEE

Year: 2014

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Investigation on AlCu-clad base plates and a new by-pass cooler for pin fin power modules

Growth of low defect-density InP on exact Si (001) substrates by metalorganic chemical vapor deposition with position-controlled seed arrays

Laminate with Thermal - Power Insert for Efficient Front-Side Heat Removal and Power Delivery

Surface Profiles of Printed Ag Nanoparticle Paste and Their Implication on the Quality of Sintered Joints

Reliability assessment of molded Smart Power Modules

3D stereoscopic game development technique for smart TVs

Haptic strip based on modular independent actuators for virtual shapes rendering

100K Q-factor toroidal ring gyroscope implemented in wafer-level epitaxial silicon encapsulation process

AlGaN/GaN MIS-HFET with improvement in high temperature gate bias stress-induced reliability

Misleading Generalized Itemset Mining in the Cloud

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Investigation on AlCu-clad base plates and a new by-pass cooler for pin fin power modules

Growth of low defect-density InP on exact Si (001) substrates by metalorganic chemical vapor deposition with position-controlled seed arrays

Laminate with Thermal - Power Insert for Efficient Front-Side Heat Removal and Power Delivery

Surface Profiles of Printed Ag Nanoparticle Paste and Their Implication on the Quality of Sintered Joints

Reliability assessment of molded Smart Power Modules

3D stereoscopic game development technique for smart TVs

Haptic strip based on modular independent actuators for virtual shapes rendering

100K Q-factor toroidal ring gyroscope implemented in wafer-level epitaxial silicon encapsulation process

AlGaN/GaN MIS-HFET with improvement in high temperature gate bias stress-induced reliability

Misleading Generalized Itemset Mining in the Cloud