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    Data offloading in two-tier networks: A contract design approach 

    Type: Conference Paper
    Author : Zhou, Zilong; Feng, Xinxin; Gan, Xiaoying; Yang, Feng; Tian, Xiaohua; Wang, Xinbing
    Publisher: IEEE
    Year: 2014

    Analysis of ESD-robustness of Multi Layer Ceramic Capacitors in system applications 

    Type: Conference Paper
    Author : Scheier, Stanislav; Frei, Stephan
    Publisher: IEEE
    Year: 2014

    [Copyright notice] 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Pockels effect study in strained silicon Mach-Zenhder interferometer 

    Type: Conference Paper
    Author : Damas, P.; Le Roux, X.; Le Bourdais, D.; Cassan, E.; Marris-Morini, D.; Izard, N.; Maillard, F.; Maroutian, T.; Lecoeur, P.; Vivien, L.
    Publisher: IEEE
    Year: 2014

    Intra-Cluster Device-to-Device Multicast Algorithm Based on Small World Model 

    Type: Conference Paper
    Author : Chen, Nannan; Tian, Hui; Wang, Zhibo; Jiang, Li
    Publisher: IEEE
    Year: 2014

    Symmetric Degrees of Freedom of the MIMO 3-way channel with M<inf>T</inf> &#x00D7; M<inf>R</inf> antennas 

    Type: Conference Paper
    Author : Maier, Henning; Chaaban, Anas; Mathar, Rudolf
    Publisher: IEEE
    Year: 2014

    Effects of a modified interface by silver nanoparticles/SiOC:H barrier layer against space charge injection under HVDC 

    Type: Conference Paper
    Author : Milliere, Laurent; Makasheva, Kremena; Laurent, Christian; Despax, Bernard; Boudou, Laurent; Teyssedre, Gilbert
    Publisher: IEEE
    Year: 2014

    Design and analysis of the controllable output impedance method for parallel single-phase inverters 

    Type: Conference Paper
    Author : Liu, Haixian; Zhao, Jinbin; Qu, Keqing
    Publisher: IEEE
    Year: 2014

    A location authentication scheme based on adjacent users 

    Type: Conference Paper
    Author : Hua, Liang; Dai, Jiazhu
    Publisher: IEEE
    Year: 2014

    Investigation on dielectric properties in gelatin-based phantom for human brain 

    Type: Conference Paper
    Author : Said, M.S.M.; Seman, N.; Rahim, M.K.A.; Rahman, T.A.
    Publisher: IEEE
    Year: 2014
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