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    Metal cap with two slots covering an edge of a mobile device substrate for 60GHz band 

    Type: Conference Paper
    Author : Ito, Kohei; Hirokawa, Jiro; Sakurai, Kimio; Ando, Makoto
    Publisher: IEEE
    Year: 2014

    Voice activity detection based on ensemble empirical mode decomposition and teager kurtosis 

    Type: Conference Paper
    Author : Chong Feng; Chunhui Zhao
    Publisher: IEEE
    Year: 2014

    A spoken dialogue system with situation and emotion detection based on anthropomorphic learning for warming healthcare d 

    Type: Conference Paper
    Author : Su, Bo-Hao; Fu, Ping-Wen; Lin, Po-Chuan; Shih, Po-Yi; Lin, Yuh-Chung; Wang, Jhing-Fa; Tsai, An-Chao
    Publisher: IEEE
    Year: 2014

    Module design temperature measurements were made 

    Type: Conference Paper
    Author : Titov, D.E.; Ugarov, G.G.; Soshinov, A.G.
    Publisher: IEEE
    Year: 2014

    DOA estimation of multi-band signals using a compressed sensing technique 

    Type: Conference Paper
    Author : Terada, Tsubasa; Nishimura, Toshihiko; Ogawa, Yasutaka; Ohgane, Takeo; Yamada, Hiroyoshi
    Publisher: IEEE
    Year: 2014

    TEMPEST: Test environment for performance evaluation of the scheduling of packets 

    Type: Conference Paper
    Author : Grazia, C.A.; Casoni, M.; Valente, P.
    Publisher: IEEE
    Year: 2014

    A novel application model and an offloading mechanism for efficient mobile computing 

    Type: Conference Paper
    Author : Barrameda, Jose; Samaan, Nancy
    Publisher: IEEE
    Year: 2014

    An adaptive transmission scheme for multiuser MIMO broadcast channel in Cognitive Radio 

    Type: Conference Paper
    Author : Le, Chung; Moghaddamnia, Sanam; Peissig, Jurgen
    Publisher: IEEE
    Year: 2014

    Copyright Page 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Tackling QoS-induced aging in exascale systems through agile path selection 

    Type: Conference Paper
    Author : Ancajas, Dean Michael; Chakraborty, Koushik; Roy, Sanghamitra; Allred, Jason
    Publisher: IEEE
    Year: 2014
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