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High power SiC inverter module packaging solutions for junction temperature over 220°C

Type: Conference Paper

Author : Woo, Daniel Rhee Min; Yuan, Hwang How; Li, Jerry Aw Jie; Ling, Ho Siow; Bum, Lee Jong; Songbai, Zhang

Publisher: IEEE

Year: 2014

A portable point-of-use EIS device for in-vivo biomédical applications

Type: Conference Paper

Author : Punter-Villagrasa, Jaime; del Moral-Zamora, Beatriz; Colomer-Farrarons, Jordi; Miribel-Catala, Pere; Rodriguez-Villarreal, Ivon; Cid, Joan; Prieto-Simon, Beatriz

Publisher: IEEE

Year: 2014

Characteristic information extraction and developing process recognizing method of surface discharge in oil immersed paper insulation

Type: Conference Paper

Author : Lu Cui; Weigen Chen; Bo Xie; Jie Du; Zhenze Long; Yongsen Li

Publisher: IEEE

Year: 2014

Keynote 1 — Peter Chochrane

Type: Conference Paper

Author : Teixeira, Antonio

Publisher: IEEE

Year: 2014

Iterative approach to estimate the parameters of a TVAR process corrupted by a MA noise

Type: Conference Paper

Author : Ijima, Hiroshi; Diversi, Roberto; Grivel, Eric

Publisher: IEEE

Year: 2014

Design principles and challenges for an autonomous WSN for structural health monitoring in aircrafts

Type: Conference Paper

Author : Losada, Markos; Irizar, Andoni; del Campo, Pablo; Ruiz, Pedro; Leventis, Apostolos

Publisher: IEEE

Year: 2014

A novelty approach of symmetric encryption algorithm

Type: Conference Paper

Author : Dasari, Kishore; Srikanth, V.; Veramallu, B.; Kumar, S.Satish; Srinivasulu, K

Publisher: IEEE

Year: 2014

3DLive: A multi-modal sensing platform allowing tele-immersive sports applications

Type: Conference Paper

Author : Poussard, Benjamin; Richir, Simon; Vatjus-Anttila, Jukka; Asteriadis, Stylianos; Zarpalas, Dimitrios; Daras, Petros

Publisher: IEEE

Year: 2014

Application of BP algorithm in short-term load forecasting

Type: Conference Paper

Author : Xiao Shaohua; Liu Xizhe

Publisher: IEEE

Year: 2014

Inkjet printed transmission line elements for RF applications and measurement challenges

Type: Conference Paper

Author : Narampanawe, Nishshanka Bandara; Yak, See Kye; Jie, Zhang

Publisher: IEEE

Year: 2014

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High power SiC inverter module packaging solutions for junction temperature over 220°C

A portable point-of-use EIS device for in-vivo biomédical applications

Characteristic information extraction and developing process recognizing method of surface discharge in oil immersed paper insulation

Keynote 1 — Peter Chochrane

Iterative approach to estimate the parameters of a TVAR process corrupted by a MA noise

Design principles and challenges for an autonomous WSN for structural health monitoring in aircrafts

A novelty approach of symmetric encryption algorithm

3DLive: A multi-modal sensing platform allowing tele-immersive sports applications

Application of BP algorithm in short-term load forecasting

Inkjet printed transmission line elements for RF applications and measurement challenges

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High power SiC inverter module packaging solutions for junction temperature over 220&#x00B0;C

A portable point-of-use EIS device for in-vivo biom&#x00E9;dical applications

Characteristic information extraction and developing process recognizing method of surface discharge in oil immersed paper insulation

Keynote 1 &#x2014; Peter Chochrane

Iterative approach to estimate the parameters of a TVAR process corrupted by a MA noise

Design principles and challenges for an autonomous WSN for structural health monitoring in aircrafts

A novelty approach of symmetric encryption algorithm

3DLive: A multi-modal sensing platform allowing tele-immersive sports applications

Application of BP algorithm in short-term load forecasting

Inkjet printed transmission line elements for RF applications and measurement challenges

High power SiC inverter module packaging solutions for junction temperature over 220°C

A portable point-of-use EIS device for in-vivo biomédical applications

Keynote 1 — Peter Chochrane