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Now showing items 1-8 of 8
Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs
Publisher: IEEE
Year: 2014
Improvements in the silicon photonics design flow: Collaboration and standardization
Publisher: IEEE
Year: 2014
Optimal coordinated operation for microgrid with hybrid energy storage and diesel generator
Publisher: IEEE
Year: 2014
OFDM to OTDM conversion by fractional Fourier transform
Publisher: IEEE
Year: 2014
Gains of anycast demand relocation in survivable elastic optical networks
Publisher: IEEE
Year: 2014
Fleeting objects, enduring information
Publisher: IEEE
Year: 2014