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Now showing items 1-6 of 6
In situ monitoring of interface delamination by the 3ω-method
Publisher: IEEE
Year: 2014
Group-wise consistent cortical parcellation based on DTI-derived connectional profiles
Publisher: IEEE
Year: 2014
3D self-heating electro-thermal model of multi-die IC
Publisher: IEEE
Year: 2014
Time Domain Loop Interference Channel Estimation and Cancellation for Mobile MIMO Wireless Relays
Publisher: IEEE
Year: 2014
Facial expression analysis for emotion recognition using kernel methods and statistical models
Publisher: IEEE
Year: 2014
2014 IEEE Lester Eastman Conference - Best Student Paper Award [& Best Poster Award]
Publisher: IEEE
Year: 2014