A new technology for integration of high frequency active devices into low cost silicon substrates has been introduced. The novel fabrication process gives excellent advantages such as extremely low thermal resistance, and ...

In this paper, we address the most important issues related to realisation of μ-wave and mm-wave circuits containing power devices in the novel technology of Quasi-Monolithic Integration Technology (QMIT). A finite element simulator (2D and 3D), a...

Fabrication process and advantages of the new generation quasi-monolithic integration technology are presented. The novel fabrication process gives excellent advantages such as extremely low thermal resistance, and a much lower thermal stress than...

Three dimensional (3D) full-wave electromagnetic simulations are used to investigate high frequency performance of interconnects in quasi-monolithic integration technology (QMIT). The results are calculated for different structures of QMIT, earlier...

In this paper thermal stress distribution in QMIT structure which results from differences in thermal expansion coefficient of materials involved, has been simulated and measured. A three dimensional finite element method ...

We report on the quasi-monolithic integration of unpackaged high-power AlGaN/GaN HEMTs into a silicon basis, which finally will be the backbone and main part of an integrated circuit. III/V compound semiconductor devices fulfil special tasks which...

Quasi-Monolithic Integration Technology for Flexible and Reliable Design of Microwave and Millimeterwave Circuits...

In this paper a two dimensional finite element heat transfer simulation has been used to optimise the standard QMIT structure for high power microwave and millimetre wave applications taking into account limitations in ...

It is well known that thermal stress not only effects the reliability and life time of the packaging but also the device characteristics, which is crucial in microwave and millimeter wave design. A three dimensional finite ...

Three Dimensional Static Thermal Analysis of Quasi-Monolithic Integration Technology (QMIT)...