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    High efficiency data center power supply using wide band gap power devices 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    A method for UV-bonding in the fabrication of glass electrophoretic microchips 

    Type: Journal Paper
    Author : Zhili Huang; Joshua C. Sanders; Celeste Dunsmor; محمد حسین احمدزاده; James P. Landers; Hossein Ahmadzadeh
    Year: 2001
    Abstract:

    This paper presents an approach for the development of methodologies amenable to

    simple and inexpensive microchip fabrication, potentially applicable to dissimilar

    materials bonding and chip integration. The ...

    Artificial neural network based controller for active power line conditioner 

    Type: Conference Paper
    Author : Kiran, U.R. , Rao, D.V. , Tiwari, S. , Jain, S.
    Publisher: IEEE
    Year: 2014

    P+ multiple resonant control for output voltage regulation of microgrid with unbalanced and nonlinear loads 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Defining Value When Managing IT Investments 

    Type: Conference Paper
    Author : Kramer, J.
    Publisher: IEEE
    Year: 2014

    Single-phase grid-tie photovoltaic inverter using maximum power point tracking with flyback converter 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Tri-axial all-metal inertial microswitch with compliant stationary electrodes to prolong contact time 

    Type: Journal Paper
    Author : Wenguo Chen; Zhaoyu Wang; Yan Wang; Zhuoqing Yang; Guifu Ding; Hong Wang; Xiaolin Zhao
    Publisher: IET
    Year: 2014

    Microfabrication of a high-density, non-neutral antimatter trap 

    Type: Journal Paper
    Author : Narimannezhad, Alireza; Jennings, Joshah; Weber, Marc H.; Lynn, Kelvin G.
    Publisher: IET
    Year: 2014

    An all-digital delay-locked loop for high-speed memory interface applications 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    LTE Security potential vulnerability and algorithm enhancements 

    Type: Conference Paper
    Author : Siwach, G. , Esmailpour, A.
    Publisher: IEEE
    Year: 2014
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