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    Learning an Image-Based Motion Context for Multiple People Tracking 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Gated piezoresistive GaN microcantilever as an acoustic transducer 

    Type: Conference Paper
    Author : Talukdar, A. , Koley, G.
    Publisher: IEEE
    Year: 2014

    Interconnects Analyses in Quasi-Monolithic Integration Technology (QMIT) 

    Type: Conference Paper
    Author : مجتبی جودکی; A.G. Qimonda; A. Kricke; H. Hillmer; G. Kompa; Mojtaba Joodaki
    Year: 2006
    Abstract:

    Three dimensional (3D) full-wave electromagnetic simulations are used to investigate high frequency performance of interconnects in quasi-monolithic integration technology (QMIT). The results are calculated for different structures of QMIT, earlier...

    System-level design methodology enabling fast development of baseband MP-SoC for 4G small cell base station 

    Type: Conference Paper
    Author : Tang Shan , Zhu Ziyuan , Su Yongtao
    Publisher: IEEE
    Year: 2014

    Contents 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Repeater insertion for carbon nanotube interconnects 

    Type: Journal Paper
    Author : Wen-Sheng Zhao; Gaofeng Wang; Lingling Sun; Wen-Yan Yin; Yong-Xin Guo
    Publisher: IET
    Year: 2014

    Exploration of Electrical and Novel Optical Chip-to-Chip Interconnects 

    Type: Journal Paper
    Author : Wulong Liu; Yu Wang; Xue Feng; Yidong Huang; Huazhong Yang; Yuan Xie; Guoqing Chen
    Publisher: IEEE
    Year: 2014

    Improved Analytical Delay Models for RC-Coupled Interconnects 

    Type: Journal Paper
    Author : Feng Shi; Xuebin Wu; Zhiyuan Yan
    Publisher: IEEE
    Year: 2014

    A New Sensitivity-Driven Process Variation Aware Self-Repairing Low-Power SRAM Design 

    Type: Conference Paper
    Author : Yadav, N. , Dutt, S. , Sharma, G.K.
    Year: 2014

    Automatic generation control by SMES-SMES controllers of two-area hydro-hydro system 

    Type: Conference Paper
    Author : Roy, A. , Dutta, S. , Roy, P.K.
    Publisher: IEEE
    Year: 2014
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