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    Capacitance/Conductance&#x2013;Voltage&#x2013;Frequency Characteristics of <formula formulatype="inline"> <img src="/images/tex/21361.gif" alt="{\\rm Au}/{\\rm PVC}+{\\rm TCNQ}/{\\rm p}\\hbox {-}{\\rm Si}"> </formula> Structures in Wide Frequency Range 

    Type: Journal Paper
    Author : Kaya, Ahmet; Tecimer, Huseyin; Vural, Ozkan; Tasdemir, Ibrahim Hudai; Altindal, S.
    Publisher: IEEE
    Year: 2014

    [Title page] 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Hardware/software approach for code synchronization in low-power multi-core sensor nodes 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Liquid-filled sealed MEMS capsules fabricated by fluidic self-assembly 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    High accurate affordable car navigation using built-in sensory data and images acquired from a front view camera 

    Type: Conference Paper
    Author : Hojun Kim , Kyoungah Choi , Impyeong Lee
    Publisher: IEEE
    Year: 2014

    Overlay routing network construction by introducing Super-Relay nodes 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    An Analysis of the Relationship between a Write Access Reduction Method for NVM/DRAM Hybrid Memory with Programming Language Runtime Support and Execution Policies of Garbage Collection 

    Type: Conference Paper
    Author : Nakagawa, Gaku; Oikawa, Shuichi
    Publisher: IEEE
    Year: 2014

    Visual secret sharing with meaningful shares 

    Type: Conference Paper
    Author : Shyu, Shyong Jian
    Publisher: IEEE
    Year: 2014

    Architecture design and timing analysis of GNC system based on time-triggered architecture 

    Type: Conference Paper
    Author : Lin Yue , Jia Yingmin , Gao Yanan , Fan Songtao
    Publisher: IEEE
    Year: 2014

    Stochastic testing simulator for integrated circuits and MEMS: Hierarchical and sparse techniques 

    Type: Conference Paper
    Author : Zheng Zhang; Xiu Yang; Marucci, G.; Maffezzoni, P.; Elfadel, I.A.M.; Karniadakis, G.; Daniel, L.
    Publisher: IEEE
    Year: 2014
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