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    Effect of Electromagnetic Ring Expansion on the Mechanical Property of A5083 Aluminum Alloy 

    Type: Journal Paper
    Author : Lantao Huang; Xiaotao Han; Qi Chen; Yuanhang Niu; Zhipeng Lai; Quanliang Cao; Zhongyu Zhou; Liang Li
    Publisher: IEEE
    Year: 2014

    Effects of Current Frequency on Electromagnetic Sheet Metal Forming Process 

    Type: Journal Paper
    Author : Quanliang Cao; Xiaotao Han; Zhipeng Lai; Bo Zhang; Zhongyu Zhou; Li Qiu; Liang Li
    Publisher: IEEE
    Year: 2014

    Sensorial Surfaces-Embedding Sensor Structures Into the Surface of Materials 

    Type: Journal Paper
    Author : Winkelmann, Cord; Lang, Walter
    Publisher: IEEE
    Year: 2014

    Adaptive Sensor Allocation Strategy for Process Monitoring and Diagnosis in a Bayesian Network 

    Type: Journal Paper
    Author : Kaibo Liu; Xi Zhang; Jianjun Shi
    Publisher: IEEE
    Year: 2014

    Poster abstract: ENav — A smartphone-based energy efficient vehicular navigation system 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    A resource discovery framework for cloud-based genomics computing 

    Type: Conference Paper
    Author : Femminella, Mauro; Reali, Gianluca; Valocchi, Dario; Nunzi, Emilia
    Publisher: IEEE
    Year: 2014

    Applying a micro-market inside an electric vehicles parking facility 

    Type: Conference Paper
    Author : Kriukov, A.; Vicol, B.; Gavrilas, M.
    Publisher: IEEE
    Year: 2014

    Optimal Design of Powder-Aligning and Magnetizing Fixtures for an Anisotropic-Bonded NdFeB Permanent Magnet 

    Type: Journal Paper
    Author : Dianhai Zhang; Ziyan Ren; Chang-Seop Koh
    Publisher: IEEE
    Year: 2014

    An Analytical Model for the Forming Process of Conductive-Bridge Resistive-Switching Random-Access Memory 

    Type: Journal Paper
    Author : Shaoli Lv; He Wang; Jinyu Zhang; Jun Liu; Lingling Sun; Zhiping Yu
    Publisher: IEEE
    Year: 2014

    Poster abstract: Implications of target diversity for organic device-free localization 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014
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