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    Design cycle and embedded systems platform applied to Industrial Electronics for an MSc program in Industrial Engineering 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    On geographical allocation of primary frequency control reserves in large interconnected power systems 

    Type: Conference Paper
    Author : Karagiannopoulos, Stavros; Vrettos, Evangelos; Lopez, Pablo Centeno; Vrakopoulou, Maria; Oldewurtel, Frauke; Andersson, Goran; Zima, Marek
    Publisher: IEEE
    Year: 2014

    Mixer sequence design for N-path filters 

    Type: Conference Paper
    Author : Guolong Su , Redfern, A.J.
    Publisher: IEEE
    Year: 2014

    Multimodal graph theoretical analysis of functional brain connectivity using adaptive two-step strategy 

    Type: Conference Paper
    Author : Meskaldji, Djalel-Eddine , Van De Ville, Dimitri
    Publisher: IEEE
    Year: 2014

    Digital Earth in a User-Centric Perspective 

    Type: Conference Paper
    Author : Simoes, Bruno , Amicis, Raffaele De
    Publisher: IEEE
    Year: 2014

    System-by-design: A new paradigm for handling design complexity 

    Type: Conference Paper
    Author : Massa, A. , Oliveri, G. , Rocca, P. , Viani, F.
    Publisher: IEEE
    Year: 2014

    An off-line approach to dynamic output feedback robust model predictive control with ellipsoidal estimation error set 

    Type: Conference Paper
    Author : Xubin Ping , Ning Sun , Baocang Ding
    Publisher: IEEE
    Year: 2014

    Sparse Gaussian noisy independent component analysis 

    Type: Conference Paper
    Author : Palsson, F. , Ulfarsson, M.O. , Sveinsson, J.R.
    Publisher: IEEE
    Year: 2014

    Modeling of transient and static components of intrinsic emission from VLSI circuits 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    HELICS cell: Laser-cut grooves to create a high-efficiency, low-cost IBC solar cell 

    Type: Conference Paper
    Author : Mughal, W.J.; Mughal, H.A.; Laffoley, A.G.; Tarazona, A.; Simdyankin, S.; Bagnall, D.M.; Boden, S.A.; Cowern, N.E.B.
    Publisher: IEEE
    Year: 2014
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