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نمایش تعداد 1-10 از 11

Physical and Electrical Characteristics of Silver-Copper Nanopaste as Alternative Die-Attach

نوع: Journal Paper

نویسنده : Kim Seah Tan; Kuan Yew Cheong

ناشر: IEEE

سال: 2014

The simulation and analysis on transformer gas Protection Maloperation based on multiple physical fields coupling

نوع: Conference Paper

نویسنده : Qiao Wen; Zhang Baohui; Hao Zhiguo; Bo Zhiqian

ناشر: IEEE

سال: 2014

Characterizations of Nanosilver Joints by Rapid Sintering at Low Temperature for Power Electronic Packaging

نوع: Journal Paper

نویسنده : Guan-Quan Lu; Wanli Li; Yunhui Mei; Gang Chen; Xin Li; Xu Chen

ناشر: IEEE

سال: 2014

Local subspace video stabilization

نوع: Conference Paper

نویسنده : Chengzhou Tang , Ronggang Wang

ناشر: IEEE

سال: 2014

Broadband Method for the Determination of Small Sample's Electrical and Dielectric Properties at High Temperatures

نوع: Journal Paper

نویسنده : Kezionis, Algimantas; Kazlauskas, Saulius; Petrulionis, Dalius; Orliukas, Antanas Feliksas

ناشر: IEEE

سال: 2014

The Study of Thermal Resistance Deviation of High-Power LEDs

نوع: Journal Paper

نویسنده : Shang-Pin Ying; Han-Kuei Fu; Wei-Feng Tang; Rong-Ci Hong

ناشر: IEEE

سال: 2014

A SiC NMOS Linear Voltage Regulator for High-Temperature Applications

نوع: Journal Paper

نویسنده : Valle-Mayorga, Javier /A/.; Rahman, Aminur; Mantooth, Homer Alan

ناشر: IEEE

سال: 2014

Migration of Sintered Nanosilver on Alumina and Aluminum Nitride Substrates at High Temperatures in Dry Air for Electronic Packaging

نوع: Journal Paper

نویسنده : Guo-Quan Lu; Wen Yang; Yun-Hui Mei; Xin Li; Gang Chen; Xu Chen

ناشر: IEEE

سال: 2014

High frequency active-clamp buck converter for low power automotive applications

نوع: Conference Paper

نویسنده : Nan, Chenhao; Ayyanar, Raja; Xi, Youhao

ناشر: IEEE

سال: 2014

Smart cloud robot using raspberry Pi

نوع: Conference Paper

نویسنده : Prabha, S.Sathya; Antony, A.John Paul; Meena, M.Janaki; Pandian, S.R.

ناشر: IEEE

سال: 2014

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Physical and Electrical Characteristics of Silver-Copper Nanopaste as Alternative Die-Attach

The simulation and analysis on transformer gas Protection Maloperation based on multiple physical fields coupling

Characterizations of Nanosilver Joints by Rapid Sintering at Low Temperature for Power Electronic Packaging

Local subspace video stabilization

Broadband Method for the Determination of Small Sample's Electrical and Dielectric Properties at High Temperatures

The Study of Thermal Resistance Deviation of High-Power LEDs

A SiC NMOS Linear Voltage Regulator for High-Temperature Applications

Migration of Sintered Nanosilver on Alumina and Aluminum Nitride Substrates at High Temperatures in Dry Air for Electronic Packaging

High frequency active-clamp buck converter for low power automotive applications

Smart cloud robot using raspberry Pi

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Physical and Electrical Characteristics of Silver-Copper Nanopaste as Alternative Die-Attach

The simulation and analysis on transformer gas Protection Maloperation based on multiple physical fields coupling

Characterizations of Nanosilver Joints by Rapid Sintering at Low Temperature for Power Electronic Packaging

Local subspace video stabilization

Broadband Method for the Determination of Small Sample's Electrical and Dielectric Properties at High Temperatures

The Study of Thermal Resistance Deviation of High-Power LEDs

A SiC NMOS Linear Voltage Regulator for High-Temperature Applications

Migration of Sintered Nanosilver on Alumina and Aluminum Nitride Substrates at High Temperatures in Dry Air for Electronic Packaging

High frequency active-clamp buck converter for low power automotive applications

Smart cloud robot using raspberry Pi