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Ground Bounce Noise Induced by Crosstalk Noise for Two Parallel Ground Planes With a Narrow Open-Stub Line and Adjacent Signal Traces in Multilayer Package Structure

Type: Journal Paper

Author : Guang-Hwa Shiue; Chi-Lou Yeh; Pei-Wei Huang; Huan-Yi Liao; Zhi-Hao Zhang

Publisher: IEEE

Year: 2014

FDFD Modeling of Signal Paths With TSVs in Silicon Interposer

Type: Journal Paper

Author : Biancun Xie; Swaminathan, Madhavan

Publisher: IEEE

Year: 2014

Semantic interoperability in the OR.NET project on networking of medical devices and information systems — A requirements analysis

Type: Conference Paper

Publisher: IEEE

Year: 2014

Author

Biancun Xie (1)

Chi-Lou Yeh (1)

Guang-Hwa Shiue (1)

Huan-Yi Liao (1)

Pei-Wei Huang (1)

Swaminathan, Madhavan (1)

Zhi-Hao Zhang (1)

Publisher

IEEE (3)

Year

2014 (3)

Keywords

3D full-wave simulator (2)

3D FDFD method (1)

3D finite-difference frequency-domain (1)

3D full-wave simulations (1)

adjacent signal traces (1)

bandwidth 0.43 GHz (1)

Capacitors (1)

computer simulation technology (1)

coupled noise (1)

crosstalk (1)

Type

Journal Paper (2)

Conference Paper (1)

Language (ISO)

English (3)

Content Type

Metadata Only (3)

Publication Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on (2)

iomedical and Health Informatics (BHI), 2014 IEEE-EMBS International Conference on (1)

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