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نمایش تعداد 1-10 از 11

Microscopic numerical simulation and experimental study of thermal deformation of mechanical parts

نوع: Conference Paper

نویسنده : Miao, Enming; Xu, Zhishang; Zhou, Xiaoshuai; Lei, Derong; Li, Guannan

ناشر: IEEE

سال: 2014

Thermal fatigue life and reliability evaluation of die attachment layer of high power LED under thermal cycling conditions

نوع: Conference Paper

نویسنده : Yao Hsu; Wen-Fang Wu; Shih-Lin Lai

ناشر: IEEE

سال: 2014

Analytical prediction and verifications for inductance profile of tubular transverse flux machines with generic steel lamination

نوع: Conference Paper

نویسنده : Wang Qian; Zhao Bo; Hu Jianhui; Li Yong; Zou Jibin; Niu Tongmao; Zhao Hui

ناشر: IEEE

سال: 2014

Using genetic algorithms to improve the reliability of dual homed wireless critical services

نوع: Conference Paper

نویسنده : Folstad, E.L.; Helvik, B.E.

ناشر: IEEE

سال: 2014

Study of low frequency noise in advanced SiGe:C heterojunction bipolar transistors

نوع: Conference Paper

نویسنده : Seif, M.; Pascal, F.; Sagnes, B.; Hoffmann, A.; Haendler, S.; Chevalier, P.; Gloria, D.

ناشر: IEEE

سال: 2014

A Compiler Extension for Parallel Matrix Programming

نوع: Conference Paper

نویسنده : Williams, Kevin; Le, Matthew; Kaminski, Ted; Wyk, Eric Van

ناشر: IEEE

سال: 2014

Dynamic prediction method of route travel time based on interval velocity measurement system

نوع: Conference Paper

نویسنده : Min Wang; Qing Ma

ناشر: IEEE

سال: 2014

Integrity Levels: A New Paradigm for Protecting Computing Systems

نوع: Conference Paper

نویسنده : Jenkins, C.; Pierson, L.

ناشر: IEEE

سال: 2014

Author index

نوع: Conference Paper

ناشر: IEEE

سال: 2014

Signboard design system through social voting technique

نوع: Conference Paper

نویسنده : Takenouchi, H.; Inoue, H.; Tokumaru, M.

ناشر: IEEE

سال: 2014

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Microscopic numerical simulation and experimental study of thermal deformation of mechanical parts

Thermal fatigue life and reliability evaluation of die attachment layer of high power LED under thermal cycling conditions

Analytical prediction and verifications for inductance profile of tubular transverse flux machines with generic steel lamination

Using genetic algorithms to improve the reliability of dual homed wireless critical services

Study of low frequency noise in advanced SiGe:C heterojunction bipolar transistors

A Compiler Extension for Parallel Matrix Programming

Dynamic prediction method of route travel time based on interval velocity measurement system

Integrity Levels: A New Paradigm for Protecting Computing Systems

Author index

Signboard design system through social voting technique

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Microscopic numerical simulation and experimental study of thermal deformation of mechanical parts

Thermal fatigue life and reliability evaluation of die attachment layer of high power LED under thermal cycling conditions

Analytical prediction and verifications for inductance profile of tubular transverse flux machines with generic steel lamination

Using genetic algorithms to improve the reliability of dual homed wireless critical services

Study of low frequency noise in advanced SiGe:C heterojunction bipolar transistors

A Compiler Extension for Parallel Matrix Programming

Dynamic prediction method of route travel time based on interval velocity measurement system

Integrity Levels: A New Paradigm for Protecting Computing Systems

Author index

Signboard design system through social voting technique