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Now showing items 1-7 of 7
The Leadership Dimension of Coping with Technostress
Publisher: IEEE
Year: 2014
When Process is Getting in the Way of Creativity and Innovation
Publisher: IEEE
Year: 2014
Comparison between wire and wireless EEG acquisition systems based on SSVEP in an Independent-BCI
Publisher: IEEE
Year: 2014
Timing for virtual TMR in logic circuits
Publisher: IEEE
Year: 2014
Comparison of new techniques based on EMD for control of a SSVEP-BCI
Publisher: IEEE
Year: 2014
Characterisation of harmonic interactions between electric vehicle battery chargers and PV inverters
Publisher: IEEE
Year: 2014