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Fast and Broadband Modeling Method for Multiple Vias With Irregular Antipad in Arbitrarily Shaped Power/Ground Planes in 3-D IC and Packaging Based on Generalized Foldy–Lax Equations

Type: Journal Paper

Author : Xin Chang; Leung Tsang

Publisher: IEEE

Year: 2014

Analysis of modes effect on signal/power integrity in finite cavity for chip and die level packaging based on a hybrid full wave method

Type: Conference Paper

Author : Xin Chang , Leung Tsang

Publisher: IEEE

Year: 2014

Managerial Entrenchment and Firm Value: A Dynamic Perspective

Type: Journal Paper

Author : Xin Chang; Hong Feng Zhang

Year: 2015

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The Effect of Auditor Quality on Financing Decisions

Type: Journal Paper

Author : Xin Chang; Sudipto Dasgupta; Gilles Hilary

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Performance improvement of CM/DM noise separator with impedance matching approach

Type: Conference Paper

Author : Xinli Chang , Wenjie Chen , Xu Yang

Publisher: IEEE

Year: 2014

Efficient electromagnetic modeling and analysis for off-chip interconnects in SIW structures and 3D ICs

Type: Conference Paper

Author : Xin Chang , Leung Tsang , Sudhakaran, S.

Publisher: IEEE

Year: 2014

Stock Liquidity and Stock Price Crash Risk

Type: Journal Paper

Author : Xin Chang; Yangyang Chen; Leon Zolotoy

Year: 2017

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Industry Expertise, Information Leakage and the Choice of M&A Advisors

Type: Journal Paper

Author : Xin Chang; Chander Shekhar; Lewis H. K. Tam; Jiaquan Yao

Year: 2016

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Audit quality, auditor compensation and initial public offering underpricing

Type: Journal Paper

Author : Xin Chang; André F. Gygax; Elaine Oon; Hong Feng Zhang

Year: 2008

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Network modeling and evolutionary optimization for scheduling in manufacturing

Type: Journal Paper

Author : Lin Lin, Xin-Chang Hao, Mitsuo Gen, Jung-Bok Jo

Year: 2012

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Fast and Broadband Modeling Method for Multiple Vias With Irregular Antipad in Arbitrarily Shaped Power/Ground Planes in 3-D IC and Packaging Based on Generalized Foldy–Lax Equations

Analysis of modes effect on signal/power integrity in finite cavity for chip and die level packaging based on a hybrid full wave method

Managerial Entrenchment and Firm Value: A Dynamic Perspective

The Effect of Auditor Quality on Financing Decisions

Performance improvement of CM/DM noise separator with impedance matching approach

Efficient electromagnetic modeling and analysis for off-chip interconnects in SIW structures and 3D ICs

Stock Liquidity and Stock Price Crash Risk

Industry Expertise, Information Leakage and the Choice of M&A Advisors

Audit quality, auditor compensation and initial public offering underpricing

Network modeling and evolutionary optimization for scheduling in manufacturing

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Fast and Broadband Modeling Method for Multiple Vias With Irregular Antipad in Arbitrarily Shaped Power/Ground Planes in 3-D IC and Packaging Based on Generalized Foldy&#x2013;Lax Equations

Analysis of modes effect on signal/power integrity in finite cavity for chip and die level packaging based on a hybrid full wave method

Managerial Entrenchment and Firm Value: A Dynamic Perspective

The Effect of Auditor Quality on Financing Decisions

Performance improvement of CM/DM noise separator with impedance matching approach

Efficient electromagnetic modeling and analysis for off-chip interconnects in SIW structures and 3D ICs

Stock Liquidity and Stock Price Crash Risk

Industry Expertise, Information Leakage and the Choice of M&A Advisors

Audit quality, auditor compensation and initial public offering underpricing

Network modeling and evolutionary optimization for scheduling in manufacturing

Fast and Broadband Modeling Method for Multiple Vias With Irregular Antipad in Arbitrarily Shaped Power/Ground Planes in 3-D IC and Packaging Based on Generalized Foldy–Lax Equations