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Fast estimation of LED's accelerated lifetime by online test method

Type: Conference Paper

Author : Qi Chen , Quan Chen , Xiaobing Luo

Publisher: IEEE

Year: 2014

Phosphor temperature reduction by optimizing the phosphor configuration in white light-emitting diode package

Type: Conference Paper

Author : Run Hu , Jinyan Hu , Xiaobing Luo

Publisher: IEEE

Year: 2014

Phase change material based heat sinks and its geometry optimization for heat transfer enhancement

Type: Conference Paper

Author : Jinyan Hu , Run Hu , Xiaobing Luo

Publisher: IEEE

Year: 2014

Study on a PZT-actuated diaphragm pump for air supply for micro fuel cells

Type: Journal Paper

Author : Xing Yang; Zhaoying Zhou; Hyejung Cho; Xiaobing Luo

Publisher: Elsevier Science

Year: 2006

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Mechanism investigation on die tilt in die attach process based on minimal free energy theory

Type: Conference Paper

Author : Huai Zheng , Yiman Wang , Lan Li , Xiaobing Luo

Publisher: IEEE

Year: 2014

Compact thermal model of double-layer microchannel heat sink with high temperature uniformity for multiple LEDs

Type: Conference Paper

Author : Yongming Zhu; Run Hu; Jinyan Hu; Xiaobing Luo

Publisher: IEEE

Year: 2014

Inhibition of phosphor sedimentation for white light-emitting diodes with a facilely realizable and economical method

Type: Conference Paper

Author : Xiang Lei; Huai Zheng; Xiaobing Luo; Sheng Liu

Publisher: IEEE

Year: 2014

Calculation of effective thermal conductivity of silicone matrix embedded with particulate phosphors in white led packages by 2D/3D unit cell method

Type: Conference Paper

Author : Run Hu; Chao Yuan; Xiaobing Luo; Ting Cheng; Sheng Liu

Publisher: IEEE

Year: 2014

Study on the effect of the phosphor distribution on the phosphor layer temperature in light emitting diodes by lattice Boltzmann method

Type: Conference Paper

Author : Lan Li; Chao Yuan; Run Hu; Huai Zheng; Xiaobing Luo

Publisher: IEEE

Year: 2014

Is thermal management outside the package enough for higher LED reliability?

Type: Conference Paper

Author : Qi Chen; Quan Chen; Run Hu; Xiaobing Luo

Publisher: IEEE

Year: 2014

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Fast estimation of LED's accelerated lifetime by online test method

Phosphor temperature reduction by optimizing the phosphor configuration in white light-emitting diode package

Phase change material based heat sinks and its geometry optimization for heat transfer enhancement

Study on a PZT-actuated diaphragm pump for air supply for micro fuel cells

Mechanism investigation on die tilt in die attach process based on minimal free energy theory

Compact thermal model of double-layer microchannel heat sink with high temperature uniformity for multiple LEDs

Inhibition of phosphor sedimentation for white light-emitting diodes with a facilely realizable and economical method

Calculation of effective thermal conductivity of silicone matrix embedded with particulate phosphors in white led packages by 2D/3D unit cell method

Study on the effect of the phosphor distribution on the phosphor layer temperature in light emitting diodes by lattice Boltzmann method

Is thermal management outside the package enough for higher LED reliability?

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Fast estimation of LED's accelerated lifetime by online test method

Phosphor temperature reduction by optimizing the phosphor configuration in white light-emitting diode package

Phase change material based heat sinks and its geometry optimization for heat transfer enhancement

Study on a PZT-actuated diaphragm pump for air supply for micro fuel cells

Mechanism investigation on die tilt in die attach process based on minimal free energy theory

Compact thermal model of double-layer microchannel heat sink with high temperature uniformity for multiple LEDs

Inhibition of phosphor sedimentation for white light-emitting diodes with a facilely realizable and economical method

Calculation of effective thermal conductivity of silicone matrix embedded with particulate phosphors in white led packages by 2D/3D unit cell method

Study on the effect of the phosphor distribution on the phosphor layer temperature in light emitting diodes by lattice Boltzmann method

Is thermal management outside the package enough for higher LED reliability?