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Sign language-Thai alphabet conversion based on Electromyogram (EMG)

Type: Conference Paper

Author : Amatanon, V.; Chanhang, S.; Naiyanetr, P.; Thongpang, S.

Publisher: IEEE

Year: 2014

Printable and transparent micro-electrocorticography (μECoG) for optogenetic applications

Type: Conference Paper

Author : Kimtan, T.; Thupmongkol, J.; Williams, J.C.; Thongpang, S.

Publisher: IEEE

Year: 2014

Author

Thongpang, S. (2)

Amatanon, V. (1)

Chanhang, S. (1)

Kimtan, T. (1)

Naiyanetr, P. (1)

Thupmongkol, J. (1)

Williams, J.C. (1)

Publisher

IEEE (2)

Year

2014 (2)

Keywords

flip-chip devices (1)

n 2.5D packaging assembly (1)

n 3D packaging assembly (1)

n flip chip assembly (1)

n HAST behavior (1)

n highly silica filled one step chip attach material (1)

n integrated circuit bonding (1)

n integrated circuit packaging (1)

n mass reflow processes (1)

n organic fluids (1)

Type

Conference Paper (2)

Language (ISO)

English (2)

Content Type

Metadata Only (2)

Publication Title

iomedical Engineering International Conference (BMEiCON), 2014 7th (1)

ngineering in Medicine and Biology Society (EMBC), 2014 36th Annual International Conference of the (1)

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