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Fast and Broadband Modeling Method for Multiple Vias With Irregular Antipad in Arbitrarily Shaped Power/Ground Planes in 3-D IC and Packaging Based on Generalized Foldy–Lax Equations

Type: Journal Paper

Author : Xin Chang; Leung Tsang

Publisher: IEEE

Year: 2014

Analysis of modes effect on signal/power integrity in finite cavity for chip and die level packaging based on a hybrid full wave method

Type: Conference Paper

Author : Xin Chang , Leung Tsang

Publisher: IEEE

Year: 2014

Numerical evaluation of the transient acoustic waveform due to a point source in a fluid‐filled borehole

Type: Journal Paper

Author : Leung Tsang; Dennis Rader

Year: 1979

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Scattering of electromagnetic waves. Advanced topics

Type: Ebook

Author : Leung Tsang; Jin Au Kong

Publisher: Wiley-Interscience

Year: 2001

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Scattering of Electromagnetic Waves Vol. 3: Advanced Topics

Type: Ebook

Author : Leung Tsang; Jin Au Kong

Publisher: Wiley-Interscience

Year: 2001

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Scattering of electromagnetic waves. Advanced topics

Type: Ebook

Author : Leung Tsang; Jin Au Kong

Publisher: Wiley

Year: 2001

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Loss and back-coupling effects on subwavelength imaging of three-dimensional superlens

Type: Journal Paper

Author : Haogang Wang; Leung Tsang; Shaowu Huang

Year: 2012

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Multiple scattering effects with inclusion of cyclical terms in radar scattering of vegetated surfaces using vector radiative transfer theory

Type: Conference Paper

Author : Shurun Tan; Leung Tsang; Seung-Bum Kim

Publisher: IEEE

Year: 2014

Efficient electromagnetic modeling and analysis for off-chip interconnects in SIW structures and 3D ICs

Type: Conference Paper

Author : Xin Chang , Leung Tsang , Sudhakaran, S.

Publisher: IEEE

Year: 2014

Coherent model of L band radar scattering by soya bean fields using analytic methods and Monte Carlo simulations

Type: Conference Paper

Author : Huanting Huang; Xiaolan Xu; Leung Tsang

Publisher: IEEE

Year: 2014

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Fast and Broadband Modeling Method for Multiple Vias With Irregular Antipad in Arbitrarily Shaped Power/Ground Planes in 3-D IC and Packaging Based on Generalized Foldy–Lax Equations

Analysis of modes effect on signal/power integrity in finite cavity for chip and die level packaging based on a hybrid full wave method

Numerical evaluation of the transient acoustic waveform due to a point source in a fluid‐filled borehole

Scattering of electromagnetic waves. Advanced topics

Scattering of Electromagnetic Waves Vol. 3: Advanced Topics

Scattering of electromagnetic waves. Advanced topics

Loss and back-coupling effects on subwavelength imaging of three-dimensional superlens

Multiple scattering effects with inclusion of cyclical terms in radar scattering of vegetated surfaces using vector radiative transfer theory

Efficient electromagnetic modeling and analysis for off-chip interconnects in SIW structures and 3D ICs

Coherent model of L band radar scattering by soya bean fields using analytic methods and Monte Carlo simulations

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Fast and Broadband Modeling Method for Multiple Vias With Irregular Antipad in Arbitrarily Shaped Power/Ground Planes in 3-D IC and Packaging Based on Generalized Foldy&#x2013;Lax Equations

Analysis of modes effect on signal/power integrity in finite cavity for chip and die level packaging based on a hybrid full wave method

Numerical evaluation of the transient acoustic waveform due to a point source in a fluid‐filled borehole

Scattering of electromagnetic waves. Advanced topics

Scattering of Electromagnetic Waves Vol. 3: Advanced Topics

Scattering of electromagnetic waves. Advanced topics

Loss and back-coupling effects on subwavelength imaging of three-dimensional superlens

Multiple scattering effects with inclusion of cyclical terms in radar scattering of vegetated surfaces using vector radiative transfer theory

Efficient electromagnetic modeling and analysis for off-chip interconnects in SIW structures and 3D ICs

Coherent model of L band radar scattering by soya bean fields using analytic methods and Monte Carlo simulations

Fast and Broadband Modeling Method for Multiple Vias With Irregular Antipad in Arbitrarily Shaped Power/Ground Planes in 3-D IC and Packaging Based on Generalized Foldy–Lax Equations