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The study of different transmission lines in high speed optical module

Type: Conference Paper

Author : Huimin He; Baoxia Li; Yu Sun

Publisher: IEEE

Year: 2014

Analysis on electromagnetic isolation issues among multi-chips in system in package

Type: Conference Paper

Author : Peng Wu; Fengman Liu; Yi He; Huimin He; Jun Li; Liqiang Cao; Dongkai Shangguan; Lixi Wan

Publisher: IEEE

Year: 2014

Author

Huimin He (2)

Baoxia Li (1)

Dongkai Shangguan (1)

Fengman Liu (1)

Jun Li (1)

Liqiang Cao (1)

Lixi Wan (1)

Peng Wu (1)

Yi He (1)

Yu Sun (1)

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IEEE (2)

Year

2014 (2)

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Computers (1)

Conferences (1)

Information theory (1)

Joints (1)

Random variables (1)

Relay networks (telecommunications) (1)

Semiconductor lasers (1)

Zinc (1)

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Conference Paper (2)

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English (2)

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Metadata Only (2)

Publication Title

lectronic Packaging Technology (ICEPT), 2014 15th International Conference on (2)

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