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Now showing items 1-9 of 9

Spray coating process with polymer material for insulation in CIS-TSV wafer-level-packaging

Type: Conference Paper

Author : Yuechen Zhuang; Daquan Yu; Fengwei Dai; Guoping Zhang; Jun Fan

Publisher: IEEE

Year: 2014

Development of through glass tungsten via interconnect for 3D MEMS packaging

Type: Journal Paper

Author : Yu Sun; Daquan Yu; Shuangshou Yang; Xiaofeng Sun; Jing Zhang; Xiuzhen Wei; Lixi Wan

Year: 2011

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Optimization design and simulation for a band-pass-filter with IPD technology for RF front-end application

Type: Conference Paper

Author : Huijuan Wang; Jie Pan; Xiaoli Ren; Anmou Liao; Yuan Lu; Daquan Yu; Dongkai Shangguan

Publisher: IEEE

Year: 2014

Dry etching of fused silica glass in C<inf>4</inf>F<inf>8</inf>/Ar inductively coupled plasmas for through glass via (TGV) applications

Type: Conference Paper

Author : Laicun Lin; Mingchuan Zhang; Delong Qiu; Xiangmeng Jing; Feng Jiang; Daquan Yu

Publisher: IEEE

Year: 2014

Modeling, simulation and analysis of coplanar waveguide on glass substrate for 2.5D integration

Type: Conference Paper

Author : Wenya Shang; Cheng Pang; Xiaoli Ren; Zheng Qin; Daquan Yu; Dongkai Shangguan

Publisher: IEEE

Year: 2014

Electrical simulation of thin film inductors on silicon and glass substrates

Type: Conference Paper

Author : Zheng Qin; Cheng Pang; Xiaoli Ren; Wenya Shang; Dongkai Shangguan; Daquan Yu

Publisher: IEEE

Year: 2014

The process development and reliability study of low cost Area Array QFN packaging technology

Type: Conference Paper

Author : Hu Wang; Taotao Li; Xiaobo Ma; Xiaolong Wang; Shiguang Chen; Jianyou Xie; Daquan Yu

Publisher: IEEE

Year: 2014

Signal integrity analysis of a high-performance processor package with silicon interposer

Type: Conference Paper

Author : Xiaoli Ren; Cheng Pang; Feng Jiang; Zheng Qin; Kai Xue; Haiyan Liu; Daquan Yu

Publisher: IEEE

Year: 2014

Circuit modeling and structure optimization of integrated passive inductors

Type: Conference Paper

Author : Jie Pan; Huijuan Wang; Delong Qiu; Xiaoli Ren; Yuan Lu; Daquan Yu; Dongkai Shangguan

Publisher: IEEE

Year: 2014

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Spray coating process with polymer material for insulation in CIS-TSV wafer-level-packaging

Development of through glass tungsten via interconnect for 3D MEMS packaging

Optimization design and simulation for a band-pass-filter with IPD technology for RF front-end application

Dry etching of fused silica glass in C<inf>4</inf>F<inf>8</inf>/Ar inductively coupled plasmas for through glass via (TGV) applications

Modeling, simulation and analysis of coplanar waveguide on glass substrate for 2.5D integration

Electrical simulation of thin film inductors on silicon and glass substrates

The process development and reliability study of low cost Area Array QFN packaging technology

Signal integrity analysis of a high-performance processor package with silicon interposer

Circuit modeling and structure optimization of integrated passive inductors

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Spray coating process with polymer material for insulation in CIS-TSV wafer-level-packaging

Development of through glass tungsten via interconnect for 3D MEMS packaging

Optimization design and simulation for a band-pass-filter with IPD technology for RF front-end application

Dry etching of fused silica glass in C<inf>4</inf>F<inf>8</inf>/Ar inductively coupled plasmas for through glass via (TGV) applications

Modeling, simulation and analysis of coplanar waveguide on glass substrate for 2.5D integration

Electrical simulation of thin film inductors on silicon and glass substrates

The process development and reliability study of low cost Area Array QFN packaging technology

Signal integrity analysis of a high-performance processor package with silicon interposer

Circuit modeling and structure optimization of integrated passive inductors