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Now showing items 1-10 of 111
Benzo-cyclo-butene bonding process with 'stamp' printing for wafer level package
Publisher: IET
Year: 2014
Influence of gadolinium doping on the crystalline structure and optical properties of zinc oxide thin films
Publisher: IEEE
Year: 2014
Electrical obsolescence management: How to spend $1B efficiently
Publisher: IEEE
Year: 2014
Novel cellulose nanomaterials
Publisher: IEEE
Year: 2014
Fabrication of thermal-based vacuum gauge
Publisher: IET
Year: 2014
Frequency Trimming of Aluminum Nitride Microresonators Using Rapid Thermal Annealing
Publisher: IEEE
Year: 2014
Deep stacking networks with time series for speech separation
Publisher: IEEE
Year: 2014
Hybrid model for pedestrian movement simulation
Publisher: IEEE
Year: 2014
CMP process — Integrated chemical & physical phenomena in between wafer and polishing pad
Publisher: IEEE
Year: 2014
Measurement of the field characteristics from High Intensity Focused Ultrasound transducer
Publisher: IEEE
Year: 2014