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Manufacturability readiness of insulated Cu wire bonding process in PBGA package

Type: Conference Paper

Author : HungYang, Leong; BoonKar, Yap; Yong, Tan Chou; Khan, Navas; Ibrahim, Mohd Rusli; Tan, L.C.

Publisher: IEEE

Year: 2014

Uniplanar Antenna Design With Adhesive Ground Plane for Laptop WLAN Operation

Type: Journal Paper

Author : Sim, Chow-Yen-Desmond; Hsuan-Yu Chien; Ching-Her Lee

Publisher: IEEE

Year: 2014

Author

BoonKar, Yap (1)

Ching-Her Lee (1)

Hsuan-Yu Chien (1)

HungYang, Leong (1)

Ibrahim, Mohd Rusli (1)

Khan, Navas (1)

Sim, Chow-Yen-Desmond (1)

Tan, L.C. (1)

Yong, Tan Chou (1)

Publisher

IEEE (2)

Year

2014 (2)

Keywords

adhesive ground plane (1)

AGP (1)

Antenna feeds (1)

Antenna measurements (1)

Bandwidth (1)

beveled structure (1)

double-folded monopole antenna (1)

dual-band wireless local area network (1)

frequency 2.4 GHz (1)

frequency 5 GHz (1)

Type

Conference Paper (1)

Journal Paper (1)

Language (ISO)

English (2)

Content Type

Metadata Only (2)

Publication Title

Antennas and Wireless Propagation Letters, IEEE (1)

lectronics Packaging Technology Conference (EPTC), 2014 IEEE 16th (1)

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