Search
Now showing items 1-10 of 44
Influence of Cu/Ni(P) Metallized Si3N4 Ceramic Substrate in Bond Reliability of Power Components at 250 ??C
Publisher: IEEE
Year: 2014
Terahertz Pioneers
Publisher: IEEE
Year: 2014
Seeing through a mask
Publisher: IET
Year: 2014
An enhanced data security and trust management enabled framework for cloud computing systems
Publisher: IEEE
Year: 2014
Refocusing a THz Imaging Radar: Implementation and Measurements
Publisher: IEEE
Year: 2014
New power-module structures consisting of both Cu and Al bonded to AlN substrates with an Al base plate
Publisher: IEEE
Year: 2014
Guaranteed cost control for uncertain nonlinear quadratic systems
Publisher: IEEE
Year: 2014
Reflection imaging with terahertz quantum-cascade laser and quantum-well photodetector
Publisher: IET
Year: 2014
In the zone
Publisher: IET
Year: 2014
Processing universal quantification queries using MapReduce
Publisher: IEEE
Year: 2014