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    Influence of Cu/Ni(P) Metallized Si3N4 Ceramic Substrate in Bond Reliability of Power Components at 250 ??C 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Terahertz Pioneers 

    Type: Journal Paper
    Author : Siegel, Peter H.
    Publisher: IEEE
    Year: 2014

    Seeing through a mask 

    Type: Journal Paper
    Publisher: IET
    Year: 2014

    An enhanced data security and trust management enabled framework for cloud computing systems 

    Type: Conference Paper
    Author : Cindhamani, J.; Punya, Naguboynia; Ealaruvi, Rasha; Babu, L.D.Dhinesh
    Publisher: IEEE
    Year: 2014

    Refocusing a THz Imaging Radar: Implementation and Measurements 

    Type: Journal Paper
    Author : Llombart, Nuria; Blazquez, B.
    Publisher: IEEE
    Year: 2014

    New power-module structures consisting of both Cu and Al bonded to AlN substrates with an Al base plate 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Guaranteed cost control for uncertain nonlinear quadratic systems 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Reflection imaging with terahertz quantum-cascade laser and quantum-well photodetector 

    Type: Journal Paper
    Author : Tan, Zhi Yong; Tao Zhou; Fu, Zhang Long; Cao, Jun Cheng
    Publisher: IET
    Year: 2014

    In the zone 

    Type: Journal Paper
    Publisher: IET
    Year: 2014

    Processing universal quantification queries using MapReduce 

    Type: Conference Paper
    Author : Habib, W.M.A. , Mokhtar, H.M.O. , El-Sharkawi, M.
    Publisher: IEEE
    Year: 2014
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