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Power-aware multi-layer translucent network design: An integrated OPEX/CAPEX analysis

Type: Conference Paper

Publisher: IEEE

Year: 2014

On enhancing power benefits in 3D ICs: Block folding and bonding styles perspective

Type: Conference Paper

Publisher: IEEE

Year: 2014

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esign Automation Conference (DAC), 2014 51st ACM/EDAC/IEEE (1)

ptical Fiber Communications Conference and Exhibition (OFC), 2014 (1)

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