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Low-cost on-chip structures for combating die and IC recycling
Publisher: IEEE
Year: 2014
On the Minimality and Uniqueness of the Bott–Duffin Realization Procedure
Publisher: IEEE
Year: 2014
Lumped Parameter Modeling for Thermal Characterization of High-Power Modules
Publisher: IEEE
Year: 2014
Efficient calculation of cyclic convolution by means of fast Fourier transform in a finite field
Publisher: IEEE
Year: 2014
Unified hysteresis and creep compensation in AFM tip positioning with an extended PI model
Publisher: IEEE
Year: 2014
On-chip miniaturised wideband rat-race coupler using integrated passive device technology
Publisher: IET
Year: 2014
Effect of series and parallel compensation on operating reliability of transmission system
Publisher: IEEE
Year: 2014
[Copyright notice]
Publisher: IEEE
Year: 2014
Generation and detection of OAM signals for radio communications
Publisher: IEEE
Year: 2014