Search
Now showing items 1-10 of 54
High power SiC inverter module packaging solutions for junction temperature over 220°C
Publisher: IEEE
Year: 2014
A portable point-of-use EIS device for in-vivo biomédical applications
Publisher: IEEE
Year: 2014
Keynote 1 — Peter Chochrane
Publisher: IEEE
Year: 2014
Iterative approach to estimate the parameters of a TVAR process corrupted by a MA noise
Publisher: IEEE
Year: 2014
Design principles and challenges for an autonomous WSN for structural health monitoring in aircrafts
Publisher: IEEE
Year: 2014
A novelty approach of symmetric encryption algorithm
Publisher: IEEE
Year: 2014
3DLive: A multi-modal sensing platform allowing tele-immersive sports applications
Publisher: IEEE
Year: 2014
Application of BP algorithm in short-term load forecasting
Publisher: IEEE
Year: 2014
Inkjet printed transmission line elements for RF applications and measurement challenges
Publisher: IEEE
Year: 2014