Search

Now showing items 1-10 of 11

Microscopic numerical simulation and experimental study of thermal deformation of mechanical parts

Type: Conference Paper

Author : Miao, Enming; Xu, Zhishang; Zhou, Xiaoshuai; Lei, Derong; Li, Guannan

Publisher: IEEE

Year: 2014

Thermal fatigue life and reliability evaluation of die attachment layer of high power LED under thermal cycling conditions

Type: Conference Paper

Author : Yao Hsu; Wen-Fang Wu; Shih-Lin Lai

Publisher: IEEE

Year: 2014

Analytical prediction and verifications for inductance profile of tubular transverse flux machines with generic steel lamination

Type: Conference Paper

Author : Wang Qian; Zhao Bo; Hu Jianhui; Li Yong; Zou Jibin; Niu Tongmao; Zhao Hui

Publisher: IEEE

Year: 2014

Using genetic algorithms to improve the reliability of dual homed wireless critical services

Type: Conference Paper

Author : Folstad, E.L.; Helvik, B.E.

Publisher: IEEE

Year: 2014

Study of low frequency noise in advanced SiGe:C heterojunction bipolar transistors

Type: Conference Paper

Author : Seif, M.; Pascal, F.; Sagnes, B.; Hoffmann, A.; Haendler, S.; Chevalier, P.; Gloria, D.

Publisher: IEEE

Year: 2014

A Compiler Extension for Parallel Matrix Programming

Type: Conference Paper

Author : Williams, Kevin; Le, Matthew; Kaminski, Ted; Wyk, Eric Van

Publisher: IEEE

Year: 2014

Dynamic prediction method of route travel time based on interval velocity measurement system

Type: Conference Paper

Author : Min Wang; Qing Ma

Publisher: IEEE

Year: 2014

Integrity Levels: A New Paradigm for Protecting Computing Systems

Type: Conference Paper

Author : Jenkins, C.; Pierson, L.

Publisher: IEEE

Year: 2014

Author index

Type: Conference Paper

Publisher: IEEE

Year: 2014

Signboard design system through social voting technique

Type: Conference Paper

Author : Takenouchi, H.; Inoue, H.; Tokumaru, M.

Publisher: IEEE

Year: 2014

Search

Microscopic numerical simulation and experimental study of thermal deformation of mechanical parts

Thermal fatigue life and reliability evaluation of die attachment layer of high power LED under thermal cycling conditions

Analytical prediction and verifications for inductance profile of tubular transverse flux machines with generic steel lamination

Using genetic algorithms to improve the reliability of dual homed wireless critical services

Study of low frequency noise in advanced SiGe:C heterojunction bipolar transistors

A Compiler Extension for Parallel Matrix Programming

Dynamic prediction method of route travel time based on interval velocity measurement system

Integrity Levels: A New Paradigm for Protecting Computing Systems

Author index

Signboard design system through social voting technique

Author

Publisher

Year

Keywords

Type

Language (ISO)

Content Type

Publication Title

Search

Filters

Microscopic numerical simulation and experimental study of thermal deformation of mechanical parts

Thermal fatigue life and reliability evaluation of die attachment layer of high power LED under thermal cycling conditions

Analytical prediction and verifications for inductance profile of tubular transverse flux machines with generic steel lamination

Using genetic algorithms to improve the reliability of dual homed wireless critical services

Study of low frequency noise in advanced SiGe:C heterojunction bipolar transistors

A Compiler Extension for Parallel Matrix Programming

Dynamic prediction method of route travel time based on interval velocity measurement system

Integrity Levels: A New Paradigm for Protecting Computing Systems

Author index

Signboard design system through social voting technique