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TSV-to-TSV inductive coupling-aware coding scheme for 3D Network-on-Chip
Publisher: IEEE
Year: 2014
ITO spacer for optimized plasmonic enhancement of aluminium nanocubes on a-Si solar cells
Publisher: IEEE
Year: 2014
Peaking in ring modulators and application to ISI reduction
Publisher: IEEE
Year: 2014
Message from the SpaIoT 2014 Symposium Chairs
Publisher: IEEE
Year: 2014