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    Metamaterials strongly coupled to intersubband transitions: Circuit model and second order nonlinear processes 

    Type: Conference Paper
    Author : Campione, Salvatore; Benz, Alexander; Wolf, Omri; Klem, John F.; Capolino, Filippo; Sinclair, Michael B.; Brener, Igal
    Publisher: IEEE
    Year: 2014

    Design principles and performance analysis of a wimshurst generator 

    Type: Conference Paper
    Author : Bekir Ege, M.; Font, Aytug; Bolat, Suna; Kalenderli, Ozcan
    Publisher: IEEE
    Year: 2014

    Miniaturized integrated Butler Matrix for 180 GHz chip-to-chip communication 

    Type: Conference Paper
    Author : Jenning, Michael; Plettemeier, Dirk
    Publisher: IEEE
    Year: 2014

    Room temperature high-gain InAs/AlAsSb avalanche photodiode 

    Type: Conference Paper
    Author : Sun, Wenlu; Maddox, Scott J.; Bank, Seth R.; Campbell, Joe C.
    Publisher: IEEE
    Year: 2014

    Applications of circularly polarized crossed dipole antennas 

    Type: Conference Paper
    Author : Park, Ikmo; Ta, Son Xuat; Han, Jea Jin; Ziolkowski, Richard W.
    Publisher: IEEE
    Year: 2014

    Patterns of microwave modification of semiconductor thin film structures 

    Type: Conference Paper
    Author : Gordienko, Yu.E.; Slipchenko, N.I.; Poletaev, D.A.; Prokaza, A.M.; Pyataikina, M.I.
    Publisher: IEEE
    Year: 2014

    Improving Sparse 3D Models for Man-Made Environments Using Line-Based 3D Reconstruction 

    Type: Conference Paper
    Author : Hofer, Manuel; Maurer, Michael; Bischof, Horst
    Publisher: IEEE
    Year: 2014

    Field computation in inhomogeneous media using successive projections 

    Type: Conference Paper
    Author : Hay, Stuart G
    Publisher: IEEE
    Year: 2014

    Trimming Approach of Robust Clustering for Smartphone Behavioral Analysis 

    Type: Conference Paper
    Author : Attar, Ali El; Khatoun, Rida; Lemercier, Marc
    Publisher: IEEE
    Year: 2014

    Broadband III-V on silicon hybrid superluminescent LEDs by quantum well intermixing and multiple die bonding 

    Type: Conference Paper
    Author : De Groote, A.; Peters, J.D.; Davenport, M.L.; Heck, M.J.R.; Baets, R.; Roelkens, G.; Bowers, J.E.
    Publisher: IEEE
    Year: 2014
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