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    A study on swing-arm conditioning for enhancing pad lifetime in CMP 

    Type: Conference Paper
    Author : Hyunseop Lee; Dasol Lee; Haedo Jeong; Sangjik Lee
    Publisher: IEEE
    Year: 2014

    Orchestration of secure Web Services within an E-government Interoperability Platform 

    Type: Conference Paper
    Author : Penna, E.; Steffen, M.; Gonzalez, L.; Llambias, G.
    Publisher: IEEE
    Year: 2014

    Formal specification and verification of wireless networked self-organized Systems on Chip 

    Type: Conference Paper
    Author : Daoud, Hayat; Tanougast, Camel; Belarbi, Mostefa; Heil, Mikael
    Publisher: IEEE
    Year: 2014

    High speed integer multiplier designs for reconfigurable systems 

    Type: Conference Paper
    Author : Anjana, S.; Pradeep, C.
    Publisher: IEEE
    Year: 2014

    Capability and manufacturability: Some considerations concerning the current status of multi-filar dielectric loaded antennas 

    Type: Conference Paper
    Author : Leisten, O.P.
    Publisher: IEEE
    Year: 2014

    Object localization based on sparse representation for remote sensing imagery 

    Type: Conference Paper
    Author : Yokoya, N.; Iwasaki, A.
    Publisher: IEEE
    Year: 2014

    Determining the cost impact of SCM system errors 

    Type: Conference Paper
    Author : Medellin, John M.
    Publisher: IEEE
    Year: 2014

    A 12-bit 32MS/s SAR ADC using built-in self calibration technique to minimize capacitor mismatch 

    Type: Conference Paper
    Author : In-Seok Jung; Yong-Bin Kim
    Publisher: IEEE
    Year: 2014

    Modeling of &#x03C7;<sup>(2)</sup> in strained silicon based on crystal symmetry 

    Type: Conference Paper
    Author : Manganelli, C.L.; Pintus, P.; Casu, M.B.; Andriolli, N.; Di Pasquale, F.
    Publisher: IEEE
    Year: 2014

    Causes of wind turbine blade damages due to lightning and future research target to get better protection measures 

    Type: Conference Paper
    Author : Yokoyama, Shigeru; Honjo, Nobuyuki; Yasuda, Yoh; Yamamoto, Kazuo
    Publisher: IEEE
    Year: 2014
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