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Efficient region-aware P/G TSV planning for 3D ICs
Publisher: IEEE
Year: 2014
The usage of telecommunicational technologies in the integration of universities and business
Publisher: IEEE
Year: 2014
A novel technique for impedance relay to locate fault in long transmission line
Publisher: IEEE
Year: 2014
Maximum Voltage Stability Margin Problem With Complementarity Constraints for Multi-Area Power Systems
Publisher: IEEE
Year: 2014