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Capping technologies for wafer level MEMS packaging based on permanent and temporary wafer bonding
Publisher: IEEE
Year: 2014
Dual-field-of-view star sensors utilizing optical tagging approach by grating
Publisher: IEEE
Year: 2014
Study on dynamic wavelength allocation between Uplink and downlink in mobile fronthaul
Publisher: IEEE
Year: 2014
Information extraction based on probing algorithm with Bayesian approach
Publisher: IEEE
Year: 2014
Design of a wireless power transmission system for portable electronic equipment
Publisher: IEEE
Year: 2014
A Digital Hygrometer for Trace Moisture Measurement
Publisher: IEEE
Year: 2014
Assessing Energy Efficiency in ISP and Web Search Engine Collaboration
Publisher: IEEE
Year: 2014
Recursive input reconstruction with a delay
Publisher: IEEE
Year: 2014
Multicast-aware caching for small cell networks
Publisher: IEEE
Year: 2014