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    Reliability-based Design for Damping Behavior of Inner Mass Single-unit Impact Dampers 

    Type: Journal Paper
    Author : عارف افشارفرد; فرهاد کلاهان; Aref Afsharfard; Farhad Kolahan
    Year: 2013
    Abstract:

    In this paper, the dynamic response of a vibratory system equipped with a single-unit impact damper is analyzed. The reliability behavior of this system is investigated when the stress and strength are distributed lognormally. ...

    Interval estimation for the mean of lognormal data with excess zeros 

    Type: Journal Paper
    Author : Li, Xinmin - Zhou, Xiaohua - Tian, Lili
    Publisher: Elsevier Science
    Year: 2013

    Ratios , built from independent random variables and may not always be dependent 

    Type: Journal Paper
    Author : Mukhopadhyay, Nitis - Son, Mun S.
    Publisher: Elsevier Science
    Year: 2013

    Network virtualization, control plane and service orchestration of the ICT STRAUSS project 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Reliability of segmented edge seal ring for RF devices 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Using Statistics of Extremes for Electromigration and Time-Dependent Dielectric Breakdown 

    Type: Journal Paper
    Author : Blonkowski, S.; Bana, F.; Ney, D.
    Publisher: IEEE
    Year: 2014

    A Statistical Model for Shadowed Body-Centric Communications Channels: Theory and Validation 

    Type: Journal Paper
    Author : Cotton, Simon L.
    Publisher: IEEE
    Year: 2014

    AC Variability and Endurance Measurement Technique for Resistive Switching Memories 

    Type: Journal Paper
    Author : Deora, S.; Bersuker, Gennadi; Matthews, K.; Gilmer, D.C.; Kirsch, P.D.
    Publisher: IEEE
    Year: 2014

    Modeling of organic millimeterwave fishnet metamaterial structures 

    Type: Conference Paper
    Author : Russer, Johannes A.; Xiong, Ying; Russer, Peter
    Publisher: IEEE
    Year: 2014

    Design of modified Sierpinski antenna for WLAN applications 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014
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