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    A novel compacted microstrip bandpass filter using stepped impedance resonator(SIR) and defected ground structure(DGS) 

    Type: Conference Paper
    Author : Zhili Li; Wen Shi; Ye Yuan
    Publisher: IEEE
    Year: 2014

    Bonding technologies for chip level and wafer level 3D integration 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Experimental study of transparent TWT with the modulation of an electron beam near the cathode 

    Type: Conference Paper
    Author : Starodubov, A.V.; Kalinin, Yu.A.
    Publisher: IEEE
    Year: 2014

    Tracking dynamic community evolution in social networks 

    Type: Conference Paper
    Author : Dhouioui, Z.; Akaichi, J.
    Publisher: IEEE
    Year: 2014

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