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Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

Type: Journal Paper

Author : Navarro, Luis /A/.; Perpina, Xavier; Godignon, P.; Montserrat, J.; Banu, V.; Vellvehi, Miquel; Jorda, Xavier

Publisher: IEEE

Year: 2014

Scintillation Efficiency Improvement by Mixed Crystal Use

Type: Journal Paper

Publisher: IEEE

Year: 2014

GeSn Heterojunction LEDs on Si Substrates

Type: Journal Paper

Author : Oehme, Michael; Kostecki, Konrad; Arguirov, Tzanimir; Mussler, Gregor; Kaiheng Ye; Gollhofer, Martin; Schmid, Maurizio; Kaschel, Mathias; Korner, Roman Alexander; Kittler, M.; Buca, Dan; Kasper, Erich; Schulze, J.

Publisher: IEEE

Year: 2014

Analysis of autocorrelation based frequency measurement algorithm for IFM receivers

Type: Conference Paper

Year: 2014

GPU calculation algorithm for radiation from MMIC passive components

Type: Conference Paper

Author : Morita, Nagayoshi

Publisher: IEEE

Year: 2014

Evaluating Q-learning based stateful round trip time estimation over high-data-rate wireless sensor networks

Type: Conference Paper

Author : Islam, A.B.M.Alim Al; Raghunathan, Vijay

Publisher: IEEE

Year: 2014

Metal-free electric-field probe based on photonics and its EMC applications

Type: Conference Paper

Author : Togo, Hiroyoshi

Publisher: IEEE

Year: 2014

Restoration of non-uniformly warped noisy images based on coarse-to-fine optical flow estimation

Type: Conference Paper

Author : Halder, Kalyan Kumar; Tahtali, Murat; Anavatti, Sreenatha G.

Publisher: IEEE

Year: 2014

Improving I/O Throughput of Scientific Applications Using Transparent Parallel Compression

Type: Conference Paper

Author : Bicer, T. , Jian Yin , Agrawal, G.

Publisher: IEEE

Year: 2014

A dynamic state observer for real-time reconstruction of the tokamak plasma profile state and disturbances

Type: Conference Paper

Author : Felici, F. , de Baar, M. , Steinbuch, M.

Publisher: IEEE

Year: 2014

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Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

Scintillation Efficiency Improvement by Mixed Crystal Use

GeSn Heterojunction LEDs on Si Substrates

Analysis of autocorrelation based frequency measurement algorithm for IFM receivers

GPU calculation algorithm for radiation from MMIC passive components

Evaluating Q-learning based stateful round trip time estimation over high-data-rate wireless sensor networks

Metal-free electric-field probe based on photonics and its EMC applications

Restoration of non-uniformly warped noisy images based on coarse-to-fine optical flow estimation

Improving I/O Throughput of Scientific Applications Using Transparent Parallel Compression

A dynamic state observer for real-time reconstruction of the tokamak plasma profile state and disturbances

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Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications

Scintillation Efficiency Improvement by Mixed Crystal Use

GeSn Heterojunction LEDs on Si Substrates

Analysis of autocorrelation based frequency measurement algorithm for IFM receivers

GPU calculation algorithm for radiation from MMIC passive components

Evaluating Q-learning based stateful round trip time estimation over high-data-rate wireless sensor networks

Metal-free electric-field probe based on photonics and its EMC applications

Restoration of non-uniformly warped noisy images based on coarse-to-fine optical flow estimation

Improving I/O Throughput of Scientific Applications Using Transparent Parallel Compression

A dynamic state observer for real-time reconstruction of the tokamak plasma profile state and disturbances