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    Trust management mechanism for Internet of Things 

    Type: Journal Paper
    Author : Gu Lize; Wang Jingpei; Sun Bin
    Publisher: IEEE
    Year: 2014

    Estimation of automotive urea-based selective catalytic reduction systems during low temperature operations 

    Type: Conference Paper
    Author : Pingen Chen , Junmin Wang
    Publisher: IEEE
    Year: 2014

    An ontology-based approach towards comprehensive workflow modelling 

    Type: Journal Paper
    Author : Koukovini, Maria N.; Papagiannakopoulou, Eugenia /I/.; Lioudakis, Georgios V.; Dellas, Nikolaos; Kaklamani, Dimitra /I/.; Venieris, Iakovos S.
    Publisher: IET
    Year: 2014

    All-optical signal processing using InP photonic-crystal nanocavity switches 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Surface transport and DC current gain in InGaAs/InP DHBTs for THz applications 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Specification and Verification of Normative Texts Using C-O Diagrams 

    Type: Journal Paper
    Author : Diaz, Gabriel; Cambronero, Maria Emilia; Martinez, E.; Schneider, Germar
    Publisher: IEEE
    Year: 2014

    Human-machine interface quality assessment techniques: Green and safety issues 

    Type: Conference Paper
    Author : Kharchenko, V. , Orekhova, A. , Orekhov, A.
    Publisher: IEEE
    Year: 2014

    A 330 GHz frequency doubler using European MMIC Schottky process based on e-beam lithography 

    Type: Conference Paper
    Author : Treuttel, J.; Gatilova, L.; Yang, F.; Maestrini, A.; Jin, Y.; Cavanna, A.; Vacelet, T.; Tamazouzt, F.; Krieg, J.-M.; Goldstein, C.
    Publisher: IEEE
    Year: 2014

    Arrangements and applications of self-grounded antennas 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Electrode erosion characteristics and failure prediction of high-power repetitive two-electrode spark-gap switch under adverse conditions 

    Type: Conference Paper
    Author : Wu, J.W.; Liu, Y.F.; Han, R.Y.; Zhou, H.B.; Jing, Y.; Ding, W.D.
    Publisher: IEEE
    Year: 2014
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