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Clarification of Stress Field Measured by Multiwavelength Micro-Raman Spectroscopy in the Surrounding Silicon of Copper-Filled Through-Silicon Vias

Type: Journal Paper

Author : Yuen Sing Chan; Xiaowu Zhang

Publisher: IEEE

Year: 2014

Fabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization

Type: Journal Paper

Author : Lannon, J.; Hilton, Adrian; Huffman, Alan; Butler, Mairead; Malta, D.; Gregory, Chris; Temple, D.

Publisher: IEEE

Year: 2014

Gate voltage dependence of channel length modulation for InGaAs n-channel MOSFETs

Type: Conference Paper

Publisher: IEEE

Year: 2014

Author

Butler, Mairead (1)

Gregory, Chris (1)

Hilton, Adrian (1)

Huffman, Alan (1)

Lannon, J. (1)

Malta, D. (1)

Temple, D. (1)

Xiaowu Zhang (1)

Yuen Sing Chan (1)

Publisher

IEEE (3)

Year

2014 (3)

Keywords

copper (3)

Cu (3)

Si (3)

three-dimensional integrated circuits (3)

copper-filled through-silicon vias (2)

electroplating (2)

integrated circuit manufacture (2)

polymers (2)

silicon (2)

3D heterogeneous integration applications (1)

Type

Journal Paper (2)

Conference Paper (1)

Language (ISO)

English (3)

Content Type

Metadata Only (3)

Publication Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on (2)

uture of Electron Devices, Kansai (IMFEDK), 2014 IEEE International Meeting for (1)

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