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Now showing items 1-9 of 9
Modal response of bonding wires under thermal loading
Publisher: IEEE
Year: 2014
Architectural and Circuit Design Techniques for Power Management of Ultra-Low-Power MCU Systems
Publisher: IEEE
Year: 2014
Efficient SMT-based ATPG for interconnect open defects
Publisher: IEEE
Year: 2014
R-HBase: A Multi-dimensional Indexing Framework for Cloud Computing Environment
Publisher: IEEE
Year: 2014
Joint Propagation and Refinement for Mining Opinion Words and Targets
Publisher: IEEE
Year: 2014
A discrete-event simulation model to estimate the number of participants in the ciclovia program of Bogota
Publisher: IEEE
Year: 2014