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Electron emission GaN-AlGaN microwave transit-time diode

Type: Conference Paper

Publisher: IEEE

Year: 2014

A prediction model for the quantitative description of wire fray fault

Type: Conference Paper

Author : Chen Yalun; Wang Li

Publisher: IEEE

Year: 2014

Parametric Fault Testing and Performance Characterization of Post-Bond Interposer Wires in 2.5-D ICs

Type: Journal Paper

Author : Li-Ren Huang; Shi-Yu Huang; Kun-Han Tsai; Wu-Tung Cheng

Publisher: IEEE

Year: 2014

Scalable Application-Dependent Diagnosisof Interconnects of SRAM-Based FPGAs

Type: Journal Paper

Author : Almurib, Haider /A/. F.; Kumar, T. Nandha; Lombardi, Floriana

Publisher: IEEE

Year: 2014

Pulse-Vanishing Test for Interposers Wires in 2.5-D IC

Type: Journal Paper

Author : Shi-Yu Huang; Jeo-Yen Lee; Kun-Han Tsai; Wu-Tung Cheng

Publisher: IEEE

Year: 2014

Author

Kun-Han Tsai (2)

Shi-Yu Huang (2)

Wu-Tung Cheng (2)

Almurib, Haider /A/. F. (1)

Chen Yalun (1)

Jeo-Yen Lee (1)

Kumar, T. Nandha (1)

Li-Ren Huang (1)

Lombardi, Floriana (1)

Wang Li (1)

Publisher

IEEE (5)

Year

2014 (5)

Keywords

Circuit faults (5)

Delays (3)

integrated circuit interconnections (2)

Integrated circuit modeling (2)

integrated circuit testing (2)

Logic gates (2)

resistive bridging faults (2)

1-bit sum function (1)

1-BSF (1)

2.5-D IC (1)

Type

Journal Paper (3)

Conference Paper (2)

Language (ISO)

English (5)

Content Type

Metadata Only (5)

Publication Title

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on (2)

acuum Nanoelectronics Conference (IVNC), 2014 27th International (1)

Computers, IEEE Transactions on (1)

ransportation Electrification Asia-Pacific (ITEC Asia-Pacific), 2014 IEEE Conference and Expo (1)

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