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Real time FITR spectroscopic and kinetic studies of Cu surface reduction by using formic acid vapor
Publisher: IEEE
Year: 2014
Novel metrology and wafer grinder technologies combine for improved capability for TSV structures
Publisher: IEEE
Year: 2014
A new non-isolated multi-output converter with four outputs from two switches
Publisher: IEEE
Year: 2014
Hardware virtualization based security solution for embedded systems
Publisher: IEEE
Year: 2014
3D rectangular waveguide integrated in embedded Wafer Level Ball Grid Array (eWLB) package
Publisher: IEEE
Year: 2014
Adaptive partitioning strategies for loop parallelism in heterogeneous architectures
Publisher: IEEE
Year: 2014
DfST: Design for secure testability
Publisher: IEEE
Year: 2014
An algorithm to extract the generalized physical contradiction
Publisher: IEEE
Year: 2014
Collaboration in the Absence of Communication
Publisher: IEEE
Year: 2014