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Now showing items 1-3 of 3
Globally Constrained Locally Optimized 3-D Power Delivery Networks
Publisher: IEEE
Year: 2014
Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs
Publisher: IEEE
Year: 2014
Motion monitoring in palliative care using unobtrusive bed sensors
Publisher: IEEE
Year: 2014